Surface treatment of materials for adhesion bonding, second edition /
Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surfa...
Clasificación: | Libro Electrónico |
---|---|
Autores principales: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Kidlington, Oxford ; Waltham, Mass. :
William Andrew,
2014.
|
Edición: | 2nd ed. |
Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Surface Treatment of Materials for Adhesive Bonding; Copyright Page; Contents; Preface; Preface to First Edition; Acknowledgments; I. Background and Theory; 1 Introduction to Surface Preparation; 1.1 Definition of Surface Preparation, Adhesives, and Adhesive Bonding; 1.2 Introduction to Surface Treatment; 1.2.1 Degreasing; 1.2.2 Abrasion; 1.2.3 Chemical Treatment; References; 2 Surface Tension and Its Measurement; 2.1 Introduction; 2.2 What is an Interface?; 2.3 Surface Tension; 2.4 Surface Free Energy; 2.4.1 Surface Energy of Solids; 2.4.2 Work of Adhesion.
- 2.5 Contact Angle (Young's Equation)2.6 Laplace's Equation; 2.7 Effect of Temperature on Surface Tension; 2.8 Surface Tension Measurement; 2.8.1 Measurement for Liquids: Du Nouy Ring and Wilhelmy Plate Methods; 2.8.2 Measurement for Solids: Liquid Homolog Series; References; 3 Surface Energy of Solids and Its Measurement; 3.1 Introduction; 3.2 Determining the Surface Energy of Solids; 3.2.1 Fractional Polarity; 3.3 Equation of State; 3.4 Surface Tension Components; 3.5 Polymer Melt Method; 3.6 Critical Surface Tension; 3.7 Other Methods for Estimation of Surface Tension of Molten Polymer.
- 3.7.1 Grunberg and Nissan's Relationship3.7.2 Hildebrand and Scott's Equation; 3.7.3 McGowan's Equation; 3.8 Shuttleworth's Equation; References; 4 Surface and Material Characterization Techniques; 4.1 Introduction; 4.2 Surface Analysis Techniques; 4.3 Optical (Light) Microscopy; 4.4 Infrared Spectroscopy; 4.5 Raman Spectroscopy; 4.6 Scanning Electron Microscopy (SEM); 4.7 Rutherford Backscattering Theory (RBS); 4.8 Energy Dispersive X-Ray Spectroscopy (EDS); 4.9 Transmission Electron Microscopy (TEM); 4.10 Electron Spectroscopy for Chemical Analysis (ESCA).
- 4.11 Auger Electron Spectroscopy (AES)4.12 Ion Scattering Spectroscopy (ISS); 4.13 Secondary Ion Mass Spectroscopy (SIMS); 4.14 Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS); 4.15 Mass Spectroscopy or Spectrometry (MS); 4.16 Atomic Force Microscopy (AFM); 4.17 Electron Energy Loss Spectroscopy (EELS); 4.18 Gas Chromatography (GC); 4.19 Nuclear Magnetic Resonance (NMR); 4.20 Differential Scanning Calorimetry (DSC); 4.21 Differential Thermal Analysis (DTA); 4.22 Dynamic Mechanical Analysis (DMA); 4.23 Thermogravimetric Analysis (TGA); 4.24 Adhesive Bond Testing; 4.24.1 Tensile.
- 4.24.2 Shear4.24.3 Peel; References; 5 Theories of Adhesion; 5.1 Introduction; 5.2 Mechanical Theory; 5.3 Electrostatic (Electronic) Theory; 5.4 Diffusion Theory; 5.5 Wetting Theory; 5.6 Chemical Bonding; 5.6.1 Acid-Base Theory of Adhesion; 5.7 Weak Boundary Layer Theory; 5.8 Definition of Failure Modes; 5.9 Mechanisms of Bond Failure; References; II. Surface Treatment Methods and Techniques; 6 Material Surface Preparation Techniques; 6.1 Introduction; 6.2 General Considerations; 6.3 Surface Treatment of Metals; 6.4 Cleaning (Degreasing) Metals; 6.4.1 General Sequence of Cleaning.