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Practical guide to RF-MEMS /
Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Weinheim, Germany :
Wiley-VCH,
2013.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Practical Guide to RF-MEMS; Contents; Foreword; Preface; 1 RF-MEMS Applications and the State of the Art; 1.1 Introduction; 1.2 A Brief History of MEMS and RF-MEMS from the Perspective of Technology; 1.3 RF-MEMS Lumped Components; 1.3.1 Variable Capacitors; 1.3.2 Inductors; 1.3.3 Ohmic and Capacitive Switches; 1.4 RF-MEMS Complex Networks; 1.4.1 Reconfigurable Impedance-Matching Networks; 1.4.2 Reconfigurable RF Power Attenuators; 1.4.3 Reconfigurable Phase Shifters and Delay Lines; 1.4.4 Reconfigurable Switching Matrices; 1.5 Modeling and Simulation of RF-MEMS Devices.
- 1.5.1 The Finite Element Method Approach1.5.2 Compact Modeling of RF-MEMS; 1.5.3 Mixed-Domain Electromechanical Simulation Environment; 1.6 Packaging of RF-MEMS; 1.7 Brief Overview of Exploitation of RF-MEMS in RF Systems; 1.8 Conclusions; 2 The Book in Brief; 2.1 Introduction; 2.2 A Brief Introduction to the FBK RF-MEMS Technology; 2.3 An RF-MEMS Series Ohmic Switch (Dev A); 2.4 RF-MEMS Capacitive Switches/Varactors; 2.4.1 Design 1 (Dev B1); 2.4.2 Design 2 (Dev B2); 2.4.3 RF-MEMS Ohmic Switch with Microheaters (Dev C); 2.4.4 MEMS-Based Reconfigurable RF Power Attenuator (Dev D).
- 2.4.5 MEMS-Based Reconfigurable Impedance-Matching Network (Dev E)2.5 Conclusions; 3 Design; 3.1 Introduction; 3.2 Design Rules of the Fondazione Bruno Kessler RF-MEMS Technology; 3.3 Design of an RF-MEMS Series Ohmic Switch (Dev A); 3.4 Generation of 3D Models Starting from the 2D Layout; 3.5 Conclusions; 4 Simulation Techniques (Commercial Tools); 4.1 Introduction; 4.2 Static Coupled Electromechanical Simulation of the RF-MEMS Ohmic Switch (Dev A) in ANSYS MultiphysicsTM; 4.2.1 Block 1: Definition of the Geometry and Properties of the Material; 4.2.2 Block 2: Meshing of the Structure.
- 4.2.3 Block 3: Generation of the Elements for the Electromechanical Coupling4.2.4 Block 4: Definition of the Mechanical Boundary Conditions; 4.2.5 Block 5: Definition of the Simulation; 4.2.6 Block 6: Simulation Execution; 4.2.7 Block 7: Postprocessing and Visualization of Results; 4.3 Modal Analysis of the RF-MEMS Capacitive Switch (Dev B2) in ANSYS Multiphysics; 4.4 Coupled Thermoelectromechanical Simulation of the RF-MEMS Ohmic Switch with Microheaters (Dev C) in ANSYS Multiphysics; 4.5 RF Simulation (S-parameters) of the RF-MEMS Variable Capacitor (Dev B1) in ANSYS HFSSTM; 4.6 Conclusions.
- 5 On-Purpose Simulation Tools5.1 Introduction; 5.2 MEMS Compact Model Library; 5.2.1 Suspended Rigid Plate Electromechanical Transducer; 5.2.2 Flexible Beam; 5.2.3 Simulation Validation of a MEMS Toggle Switch; 5.3 A Hybrid RF-MEMS/CMOS VCO; 5.4 Excerpts of Verilog-A Code Implemented for MEMS Models; 5.4.1 Anchor Point; 5.4.2 Force Source; 5.4.3 Flexible Beam; 5.5 Conclusions; 6 Packaging and Integration; 6.1 Introduction; 6.2 A WLP Solution for RF-MEMS Devices and Networks; 6.2.1 Package Fabrication Process; 6.2.2 Wafer-to-Wafer Bonding Solutions; 6.3 Encapsulation of RF-MEMS Devices.