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00000cam a2200000Mi 4500 |
001 |
EBOOKCENTRAL_ocn852123701 |
003 |
OCoLC |
005 |
20240329122006.0 |
006 |
m o d |
007 |
cr cn||||||||| |
008 |
130111s2013 sz ad fob 001 0 eng d |
040 |
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|a LLB
|b eng
|e pn
|c LLB
|d OCLCO
|d E7B
|d CCO
|d OCLCF
|d YDXCP
|d MUU
|d CUS
|d EBLCP
|d DEBSZ
|d OCLCQ
|d OCLCO
|d AZK
|d COCUF
|d MOR
|d PIFAG
|d ZCU
|d MERUC
|d OCLCQ
|d U3W
|d STF
|d ICG
|d INT
|d VT2
|d OCLCQ
|d TKN
|d OCLCQ
|d DKC
|d OCLCQ
|d HS0
|d OCLCQ
|d TTECH
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
|
019 |
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|a 842054747
|a 897641197
|a 961631891
|a 962644281
|
020 |
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|a 9783038139201
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020 |
|
|
|a 3038139203
|
020 |
|
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|z 9783037855393
|
029 |
1 |
|
|a DEBBG
|b BV044071822
|
029 |
1 |
|
|a DEBSZ
|b 431846774
|
029 |
1 |
|
|a NZ1
|b 15590047
|
035 |
|
|
|a (OCoLC)852123701
|z (OCoLC)842054747
|z (OCoLC)897641197
|z (OCoLC)961631891
|z (OCoLC)962644281
|
050 |
|
4 |
|a T174.7
|b .I586 2013eb
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082 |
0 |
4 |
|a 620.11
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049 |
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|a UAMI
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|a Advanced Micro-Device Engineering III :
|b Selected, peer reviewed papers from the 3rd International Conference on Advanced Micro-Device Engineering (AMDE2011), December, 8th, 2011, Kiryu City Performing Arts Center, Kiryu, Japan /
|c edited by Sumio Hosaka.
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|a Selected, peer reviewed papers from the 3rd International Conference on Advanced Micro-Device Engineering (AMDE2011), December, 8th, 2011, Kiryu City Performing Arts Center, Kiryu, Japan
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260 |
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|a Switzerland :
|b Trans Tech Publications Ltd,
|c 2013.
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300 |
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|a 1 online resource (274 pages) :
|b illustrations
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336 |
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|a text
|b txt
|2 rdacontent
|
337 |
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|a computer
|b c
|2 rdamedia
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338 |
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|a online resource
|b cr
|2 rdacarrier
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1 |
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|a Key engineering materials ;
|v v. 534
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|a Includes bibliographical references and index.
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520 |
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|a The aim of this volume is to accelerate the exchange of information on the best practices for CAD, CAM, Manufacturing, Mechanical Engineering, Modeling and Simulation, etc. Engineers and scientists in academia, industry and government here address the most innovative research and development work, including technical challenges and social and economic issues, and discuss their ideas, results, work-in-progress and experience concerning all aspects of Computer-Aided Design, Manufacturing, Modeling and Simulation. Review from Book News Inc.: The result of a conference that took place in December 2011 in Kiryu, Japan, this work contains 45 relatively short papers on subjects ranging from the use of materials science in constructing micro-devices to their use in medical engineering. All of the carefully selected papers were subjected to peer review.
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8 |
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|a Synthesis of MnZn-Ferrite Using Sintering AidsElectrical Conductivity of Li2xZn2-3xTi1+xO4 Crystal; Electrical Properties of DC-Sputtered Amorphous InGaZnO4 Films; Structural Properties of SrTiO3 Transparent Thin Films Formed by RF Magnetron Sputtering with Changing Substrate Temperatures; Study of the Chemical Adsorption Property of Allylsilylazobenzene in the Surface Modification of Nanoporous Alumina Membrane; Chapter 2: Chemical Science and Technology
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505 |
8 |
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|a Preparation of Crystalline Turbostratic Boron Nitride Nanoparticles by Combination of Precursor Compound Formation and Impurity Segregation from Boric Acid and UreaEffect of Molecular Structure of Polyols with Different Molecular Characteristics on Synthesis of Boron Carbide Powder; Effective Synthesis and Isomerization of Cyclotetrasiloxanetetraol; Effect of Blending Asymmetry for Poly(L-Lactic Acid)/Poly(D-Lactic Acid) on Structural Change during Heating
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590 |
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
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650 |
|
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|a Materials.
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650 |
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6 |
|a Matériaux.
|
650 |
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7 |
|a Materials
|2 fast
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653 |
1 |
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|a micro-device engineering
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1 |
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|a AMDE
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1 |
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|a Advanced micro-device
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758 |
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|i has work:
|a Advanced Micro-Device Engineering III (Text)
|1 https://id.oclc.org/worldcat/entity/E39PD37dKbCqfThj98tG7T9hVy
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
776 |
0 |
8 |
|i Print version:
|t Advanced micro-device engineering III
|z 3037855398
|w (OCoLC)827257701
|
830 |
|
0 |
|a Key engineering materials ;
|v v. 534.
|
856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=1872994
|z Texto completo
|
938 |
|
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|a Trans Tech Publications, Ltd
|b TRAN
|n 10.4028/www.scientific.net/KEM.534
|
938 |
|
|
|a EBL - Ebook Library
|b EBLB
|n EBL1872994
|
938 |
|
|
|a ebrary
|b EBRY
|n ebr10777794
|
938 |
|
|
|a YBP Library Services
|b YANK
|n 11211310
|
994 |
|
|
|a 92
|b IZTAP
|