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Handbook of measurement in science and engineering /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Kutz, Myer (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, N.J. : John Wiley & Sons, ©2013.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Half Title page
  • Title page
  • Copyright page
  • Dedication
  • Preface
  • Contributors
  • Part IV: Materials Properties and Testing
  • Chapter 31: Viscosity Measurement
  • 31.1 Viscosity Background
  • 31.2 Common Units of Viscosity
  • 31.3 Major Viscosity Measurement Methods
  • 31.4 ASTM Standards for Measuring Viscosity
  • 31.5 Questions to Ask when Selecting a Viscosity Measurement Technique
  • References
  • Chapter 32: Tribology Measurements
  • 32.1 Introduction
  • 32.2 Measurement of Surface Roughness
  • 32.3 Measurement of Friction
  • 32.4 Measurement of Wear
  • 32.5 Measurement of Test Environment
  • 32.6 Measurement of Material Characteristics
  • 32.7 Measurement of Lubricant Characteristics
  • 32.8 Wear Particle Analysis
  • 32.9 Industrial Measurements
  • 32.10 Summary
  • Chapter 33: Corrosion Monitoring
  • 33.1 What is Corrosion Monitoring?
  • 33.2 The Role of Corrosion Monitoring
  • 33.3 Corrosion Monitoring System Considerations
  • References
  • Chapter 34: Surface Properties Measurement
  • 34.1 Introduction
  • 34.2 Surface Properties
  • 34.3 Microstructural Analysis
  • 34.4 Compositional Analysis
  • 34.5 Phase Analysis
  • 34.6 Mechanical Testing
  • 34.7 Corrosion Properties
  • 34.8 Standards for Surface Engineering Measurement
  • References
  • Chapter 35: Thermal Conductivity of Engineering Materials
  • 35.1 Introduction
  • 35.2 Stationary Methods for Measurement of the Thermal Conductivity
  • 35.3 Transient Methods for the Measurement of the Thermal Conductivity
  • 35.4 Test Results on Various Engineering Materials
  • References
  • Chapter 36: Optical Methods for the Measurement of Thermal Conductivity
  • 36.1 Thermal Boundary Resistance May Limit Accuracy in Contact-Based Thermal Conductivity (m) Measurements
  • 36.2 Optical Measurements of m May Avoid Contact-Related Issues
  • 36.3 Thermoreflectance (TR).
  • 36.4 Characteristics of Thermoreflectance from Si Thin Films-Modeling and Calibration
  • 36.5 Experimental Procedures
  • 36.6 Results and Discussion
  • 36.7 Summary and Outlook
  • Acknowledgments
  • References
  • Chapter 37: Selection of Metals for Structural Design
  • 37.1 Introduction
  • 37.2 Common Alloy Systems
  • 37.3 What are Alloys and What Affects Their Use?
  • 37.4 What are the Properties of Alloys and How Are Alloys Strengthened?
  • 37.5 Manufacture of Alloy Articles
  • 37.6 Alloy Information
  • 37.7 Metals at Lower Temperatures
  • 37.8 Metals at High Temperatures
  • 37.9 Melting and Casting Practices
  • 37.10 Forging, Forming, Powder Metallurgy, and Joining of Alloys
  • 37.11 Surface Protection of Materials
  • 37.12 Postservice Refurbishment and Repair
  • 37.13 Alloy Selection: A Look at Possibilities
  • 37.14 Level of Property Data
  • 37.15 Thoughts on Alloy Systems
  • 37.16 Selected Alloy Information Sources
  • Further Readings
  • Chapter 38: Mechanical Properties of Polymers
  • 38.1 Microstructure and Morphology of Polymers-Amorphous Versus Crystalline
  • 38.2 General Stress-Strain Behavior
  • 38.3 Viscoelasticity
  • 38.4 Mechanical Models of Viscoelasticity
  • 38.5 Time-Temperature Dependence
  • 38.6 Deformation Mechanisms
  • 38.7 Crazing
  • 38.8 Fracture
  • 38.9 Modifying Mechanical Properties
  • 38.10 Load-Bearing Applications: Creep, Fatigue Resistance, and High Strain Rate Behavior
  • References
  • Chapter 39: Electrical Properties of Polymers
  • 39.1 Introductory Remarks
  • 39.2 Polarity and Permittivity
  • 39.3 Measurements of Dielectric Permittivity
  • 39.4 Polarization and Dipole Moments in Isotropic Systems
  • 39.5 Thermostimulated Depolarization Currents
  • 39.6 Conductivity in Polyelectrolytes and Polymer-Electrolytes as Separators for Low Temperature Fuel Cells and Electrical Batteries.
  • 39.7 Semiconductors and Electronic Conducting Polymers
  • 39.8 Ferroelectricity, Pyroelectricity, and Piezoelectricity in Polymers
  • 39.9 Nonlinear Polarization in Polymers
  • 39.10 Elastomers for Actuators and Sensors
  • 39.11 Electrical Breakdown in Polymers
  • References
  • Chapter 40: Nondestructive Inspection*
  • 40.1 Introduction
  • 40.2 Liquid Penetrants
  • 40.3 Radiography
  • 40.4 Ultrasonic Methods
  • 40.5 Magnetic Particle Method
  • 40.6 Thermal Methods
  • 40.7 Eddy Current Methods
  • References
  • Chapter 41: Testing of Metallic Materials
  • 41.1 Mechanical Test Laboratory
  • 41.2 Tensile and Compressive Property Testing
  • 41.3 Creep and Stress Relaxation Testing
  • 41.4 Hardness and Impact Testing
  • 41.5 Fracture Toughness Testing
  • 41.6 Fatigue Testing
  • 41.7 Other Mechanical Testing
  • 41.8 Environmental Considerations
  • Acknowledgments
  • References
  • Chapter 42: Ceramics Testing
  • 42.1 Introduction
  • 42.2 Mechanical Testing
  • 42.3 Thermal Testing
  • 42.4 Nondestructive Evaluation Testing
  • 42.5 Electrical Testing
  • 42.6 Summary
  • References
  • Chapter 43: Plastics Testing
  • 43.1 Introduction
  • 43.2 Mechanical Properties
  • 43.3 Thermal Properties
  • 43.4 Electrical Properties
  • 43.5 Weathering Properties
  • 43.6 Optical Properties
  • Further Readings
  • Chapter 44: Testing and Instrumental Analysis for Plastics Processing: Key Characterization Techniques
  • 44.1 Ftir Spectroscopy
  • 44.2 Chromatography (GC, GC-MSD, GC-FID, and HPLC)
  • 44.3 DSC and Thermogravimetry (TGA)
  • 44.4 Rheometry
  • References
  • Chapter 45: Analytical Tools for Estimation of Particulate Composite Material Properties
  • 45.1 Introduction
  • 45.2 Concepts in Statistical Quality Control
  • 45.3 Effective Property Estimates
  • 45.4 Summary
  • References
  • Part V: Instrumentation
  • Chapter 46: Instrument Statics
  • 46.1 Terminology.
  • 46.2 Static Calibration
  • 46.3 Statistics in the Measurement Process
  • References
  • Chapter 47: Input and Output Characteristics
  • 47.1 Introduction
  • 47.2 Familiar Examples1 of Input-Output Interactions
  • 47.3 Energy, Power, Impedance
  • 47.4 Operating Point of Static Systems
  • 47.5 Transforming the Operating Point
  • 47.6 Measurement Systems
  • 47.7 Distributed Systems in Brief
  • 47.8 Concluding Remarks
  • References
  • Chapter 48: Bridge Transducers
  • 48.1 Terminology
  • 48.2 Flexural Devices in Measurement Systems
  • 48.3 The Resistance Strain Gage
  • 48.4 The Wheatstone Bridge
  • 48.5 Resistance Bridge Balance Methods
  • 48.6 Resistance Bridge Transducer Measurement System Calibration
  • 48.7 Resistance Bridge Transducer Measurement System Considerations
  • 48.8 AC Impedance Bridge Transducers
  • References
  • Further Readings
  • Chapter 49: Signal Processing
  • 49.1 Frequency-Domain Analysis of Linear Systems
  • 49.2 Basic Analog Filters
  • 49.3 Basic Digital Filter
  • 49.4 Stability and Phase Analysis
  • 49.5 Extracting Signal from Noise
  • References
  • Chapter 50: Data Acquisition and Display Systems
  • 50.1 Introduction
  • 50.2 Data Acquisition
  • 50.3 Process Data Acquisition
  • 50.4 Data Conditioning
  • 50.5 Data Storage
  • 50.6 Data Display and Reporting
  • 50.7 Data Analysis
  • 50.8 Data Communications
  • 50.9 Other Data Acquisition and Display Topics
  • 50.10 Summary
  • References
  • Part VI: Measurement Standards
  • Chapter 51: Mathematical and Physical Units, Standards, and Tables*
  • 51.1 Symbols and Abbreviations
  • Bibliography for Letter Symbols
  • Bibliography for Graphic Symbols
  • 51.2 Mathematical Tables
  • 51.3 Statistical Tables1
  • 51.4 Units and Standards
  • Bibliography for Units and Measurements
  • 51.5 Tables of Conversion Factors9
  • 51.6 Standard Sizes
  • 51.7 Standard Screws13.
  • Chapter 52: Measurement Uncertainty
  • 52.1 Introduction
  • 52.2 Literature
  • 52.3 Evaluation of Uncertainty
  • 52.4 Discussion
  • Disclaimer
  • References
  • Chapter 53: Measurements
  • 53.1 Standards and Accuracy
  • 53.2 Impedance Concepts
  • 53.3 Error Analysis
  • References
  • Index.