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Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 /

No present-day research and development program is complete without the inclusion of a robust modeling and numerical simulation component. Models and model-based numerical simulations are extensively used to probe complex materials behavior and structure in order to obtain a deeper insight into the...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Symposium Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior Boston, Mass.
Otros Autores: Tikare, Veena
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Stafa-Zurich ; Enfield, N.H. : Trans Tech, ©2008.
©2008
Colección:Diffusion and defect data. Solid state phenomena ; v. 139.
Temas:
Acceso en línea:Texto completo

MARC

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245 0 0 |a Theory, modeling and numerical simulation of multi-physics materials behavior :  |b selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 /  |c edited by Veena Tikare [and others]. 
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490 1 |a Diffusion and defect data. Pt. B, Solid state phenomena,  |x 1012-0394 ;  |v v. 139 
504 |a Includes bibliographical references and indexes. 
588 0 |a Print version record. 
520 |a No present-day research and development program is complete without the inclusion of a robust modeling and numerical simulation component. Models and model-based numerical simulations are extensively used to probe complex materials behavior and structure in order to obtain a deeper insight into the fundamentals of materials. Multi-physics models are becoming increasingly common, with advances in computational science, and are rapidly advancing the basic understanding of materials. The aim of this special collection: "Theory, modeling and numerical simulation of multi-physics behavior", with its 25 selected and peer-reviewed papers, .is to highlight the theories, models and numerical techniques that have permitted multi-physics simulations to become an integral part of research and development programs. 
505 0 |6 880-01  |a Theory, Modeling and Numerical Simulation; Preface ; Table of Contents; Atomistic Simulations of the Aluminum-Silicon Interfaces under Shear Loading; Shock Loading of Bone-Inspired Metallic Nanocomposites; Hydrogen Storage in MgH2 Matrices: An Ab-Initio Study of Mg-MgH2 Interface ; First-Principles Calculations of the Atomic and Electronic Structures in Au-Pd Slab Interfaces; In-Diffusion and Out-Diffusion of Oxygen from a Composite Containing Random Traps; Effects of Supports on Hydrogen Adsorption on Pt Clusters; First-Principles Calculations of Pd/Au(100) Interfaces with Adsorbates. 
505 8 |a In-Plane Rotated Crystal Structure in Continuous Growth of Bismuth Cuprate Superconducting FilmDynamical Interaction between Thermally Activated Glide of Screw Dislocation and Self-Interstitial Clusters in Bcc Fe; The Effects of Solute Segregation on the Evolution and Strength of Dislocation Junctions; Physics Mechanisms Involved in the Formation and Recrystallization of Amorphous Regions in Si through Ion Irradiation; Hotspot Formation in Shock-Induced Void Collapse; Molecular Dynamics Simulation of Nanocrystalline Tantalum under Uniaxial Tension. 
505 8 |6 880-02  |a Simulation of the Columnar-to-Equiaxed Transition in Alloy Solidification -- The Effect of Nucleation Undercooling, Density of Nuclei in Bulk Liquid and Alloy Solidification Range on the TransitionSimulation of Surface-Enhanced Ordering in Smectic Films; Atomic Scale Modelling of Materials: A Prerequisite for any Multi-Scale Approach to Structural and Dynamical Properties; Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints. 
546 |a English. 
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653 1 |a Numerical simulation 
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700 1 |a Tikare, Veena. 
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776 0 8 |i Print version:  |a Symposium Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior (2007 : Boston, Mass.).  |t Theory, modeling and numerical simulation of multi-physics materials behavior.  |d Stafa-Zurich ; Enfield, N.H. : Trans Tech, ©2008  |w (DLC) 2008276365  |w (OCoLC)232365311 
830 0 |a Diffusion and defect data.  |n Pt. B,  |p Solid state phenomena ;  |v v. 139. 
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880 8 |6 505-01/(S  |a Effect of C on Vacancy Migration in α-IronKeywords Index; Authors Index. 
880 8 |6 505-02/(S  |a Diffusion Mechanisms near Tilt Grain Boundaries in Ni3Al IntermetallidePhase-Transformation Wave Dynamics in LiFePO4 ; Molecular-Dynamics Analysis of the Structural Properties of Silica during Cooling; Atomistic Simulations of Copper Precipitation and Radiation Induced Segregation in α-Iron; Ab-Initio Calculation for the Study of Nano Scale Silicon Based Device Structure; Modelling of Elastic Modulus and Molecular Structure Interrelationship of an Oriented Crystalline Polymer; Reaction Rate as an Effective Tool for Analysis of Chemical Diffusion in Solids. 
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