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ESD Basics : from Semiconductor Manufacturing to Use.
Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This bookintroduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic co...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Chicester :
Wiley,
2012.
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| Colección: | ESD series.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- ESD BASICS: From Semiconductor Manufacturing to Product Use; Contents; About the Author; Preface; Acknowledgments; 1 Fundamentals of Electrostatics; 1.1 Introduction; 1.2 Electrostatics; 1.2.1 Thales of Miletus and Electrostatic Attraction; 1.2.2 Electrostatics and the Triboelectric Series; 1.2.3 Triboelectric Series and Gilbert; 1.2.4 Triboelectric Series and Gray; 1.2.5 Triboelectric Series and Dufay; 1.2.6 Triboelectric Series and Franklin; 1.2.7 Electrostatics
- Symmer and the Human Body Model; 1.2.8 Electrostatics
- Coulomb and Cavendish.
- 1.2.9 Electrostatics
- Faraday and the Ice Pail Experiment1.2.10 Electrostatics
- Faraday and Maxwell; 1.2.11 Electrostatics
- Paschen; 1.2.12 Electrostatics
- Stoney and the "Electron"; 1.3 Triboelectric Charging
- How does it Happen?; 1.4 Conductors, Semiconductors, and Insulators; 1.5 Static Dissipative Materials; 1.6 ESD and Materials; 1.7 Electrification and Coulomb's Law; 1.7.1 Electrification by Friction; 1.7.2 Electrification by Induction; 1.7.3 Electrification by Conduction; 1.8 Electromagnetism and Electrodynamics; 1.9 Electrical Breakdown.
- 1.9.1 Electrostatic Discharge and Breakdown1.9.2 Breakdown and Paschen's Law; 1.9.3 Breakdown and Townsend; 1.9.4 Breakdown and Toepler's Law; 1.9.5 Avalanche Breakdown; 1.10 Electroquasistatics and Magnetoquasistatics; 1.11 Electrodynamics and Maxwell's Equations; 1.12 Electrostatic Discharge (ESD); 1.13 Electromagnetic Compatibility (EMC); 1.14 Electromagnetic Interference (EMI); 1.15 Summary and Closing Comments; References; 2 Fundamentals of Manufacturing and Electrostatics; 2.1 Materials, Tooling, Human Factors, and Electrostatic Discharge.
- 2.1.1 Materials and Human Induced Electric Fields2.2 Manufacturing Environment and Tooling; 2.3 Manufacturing Equipment and ESD Manufacturing Problems; 2.4 Manufacturing Materials; 2.5 Measurement and Test Equipment; 2.5.1 Manufacturing Testing for Compliance; 2.6 Grounding and Bonding Systems; 2.7 Worksurfaces; 2.8 Wrist Straps; 2.9 Constant Monitors; 2.10 Footwear; 2.11 Floors; 2.12 Personnel Grounding with Garments; 2.12.1 Garments; 2.13 Air Ionization; 2.14 Seating; 2.15 Carts; 2.16 Packaging and Shipping; 2.16.1 Shipping Tubes; 2.16.2 Trays; 2.17 ESD Identification.
- 2.18 ESD Program Management
- Twelve Steps to Building an ESD Strategy2.19 ESD Program Auditing; 2.20 ESD On-Chip Protection; 2.21 Summary and Closing Comments; References; 3 ESD, EOS, EMI, EMC and Latchup; 3.1 ESD, EOS, EMI, EMC and Latchup; 3.1.1 ESD; 3.1.2 EOS; 3.1.3 EMI; 3.1.4 EMC; 3.1.5 Latchup; 3.2 ESD Models; 3.2.1 Human Body Model (HBM); 3.2.2 Machine Model (MM); 3.2.3 Cassette Model; 3.2.4 Charged Device Model (CDM); 3.2.5 Transmission Line Pulse (TLP); 3.2.6 Very Fast Transmission Line Pulse (VF-TLP); 3.3 Electrical Overstress (EOS); 3.3.1 EOS Sources
- Lightning.
- 3.3.2 EOS Sources
- Electromagnetic Pulse (EMP).