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ESD Basics : from Semiconductor Manufacturing to Use.

Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This bookintroduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic co...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Voldman, Steven H.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Chicester : Wiley, 2012.
Colección:ESD series.
Temas:
Acceso en línea:Texto completo

MARC

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245 1 0 |a ESD Basics :  |b from Semiconductor Manufacturing to Use. 
260 |a Chicester :  |b Wiley,  |c 2012. 
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505 0 |a ESD BASICS: From Semiconductor Manufacturing to Product Use; Contents; About the Author; Preface; Acknowledgments; 1 Fundamentals of Electrostatics; 1.1 Introduction; 1.2 Electrostatics; 1.2.1 Thales of Miletus and Electrostatic Attraction; 1.2.2 Electrostatics and the Triboelectric Series; 1.2.3 Triboelectric Series and Gilbert; 1.2.4 Triboelectric Series and Gray; 1.2.5 Triboelectric Series and Dufay; 1.2.6 Triboelectric Series and Franklin; 1.2.7 Electrostatics -- Symmer and the Human Body Model; 1.2.8 Electrostatics -- Coulomb and Cavendish. 
505 8 |a 1.2.9 Electrostatics -- Faraday and the Ice Pail Experiment1.2.10 Electrostatics -- Faraday and Maxwell; 1.2.11 Electrostatics -- Paschen; 1.2.12 Electrostatics -- Stoney and the "Electron"; 1.3 Triboelectric Charging -- How does it Happen?; 1.4 Conductors, Semiconductors, and Insulators; 1.5 Static Dissipative Materials; 1.6 ESD and Materials; 1.7 Electrification and Coulomb's Law; 1.7.1 Electrification by Friction; 1.7.2 Electrification by Induction; 1.7.3 Electrification by Conduction; 1.8 Electromagnetism and Electrodynamics; 1.9 Electrical Breakdown. 
505 8 |a 1.9.1 Electrostatic Discharge and Breakdown1.9.2 Breakdown and Paschen's Law; 1.9.3 Breakdown and Townsend; 1.9.4 Breakdown and Toepler's Law; 1.9.5 Avalanche Breakdown; 1.10 Electroquasistatics and Magnetoquasistatics; 1.11 Electrodynamics and Maxwell's Equations; 1.12 Electrostatic Discharge (ESD); 1.13 Electromagnetic Compatibility (EMC); 1.14 Electromagnetic Interference (EMI); 1.15 Summary and Closing Comments; References; 2 Fundamentals of Manufacturing and Electrostatics; 2.1 Materials, Tooling, Human Factors, and Electrostatic Discharge. 
505 8 |a 2.1.1 Materials and Human Induced Electric Fields2.2 Manufacturing Environment and Tooling; 2.3 Manufacturing Equipment and ESD Manufacturing Problems; 2.4 Manufacturing Materials; 2.5 Measurement and Test Equipment; 2.5.1 Manufacturing Testing for Compliance; 2.6 Grounding and Bonding Systems; 2.7 Worksurfaces; 2.8 Wrist Straps; 2.9 Constant Monitors; 2.10 Footwear; 2.11 Floors; 2.12 Personnel Grounding with Garments; 2.12.1 Garments; 2.13 Air Ionization; 2.14 Seating; 2.15 Carts; 2.16 Packaging and Shipping; 2.16.1 Shipping Tubes; 2.16.2 Trays; 2.17 ESD Identification. 
505 8 |a 2.18 ESD Program Management -- Twelve Steps to Building an ESD Strategy2.19 ESD Program Auditing; 2.20 ESD On-Chip Protection; 2.21 Summary and Closing Comments; References; 3 ESD, EOS, EMI, EMC and Latchup; 3.1 ESD, EOS, EMI, EMC and Latchup; 3.1.1 ESD; 3.1.2 EOS; 3.1.3 EMI; 3.1.4 EMC; 3.1.5 Latchup; 3.2 ESD Models; 3.2.1 Human Body Model (HBM); 3.2.2 Machine Model (MM); 3.2.3 Cassette Model; 3.2.4 Charged Device Model (CDM); 3.2.5 Transmission Line Pulse (TLP); 3.2.6 Very Fast Transmission Line Pulse (VF-TLP); 3.3 Electrical Overstress (EOS); 3.3.1 EOS Sources -- Lightning. 
505 8 |a 3.3.2 EOS Sources -- Electromagnetic Pulse (EMP). 
520 |a Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This bookintroduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. 
504 |a Includes bibliographical references. 
546 |a English. 
590 |a ProQuest Ebook Central  |b Ebook Central Academic Complete 
650 0 |a Electronic apparatus and appliances  |x Design and construction. 
650 0 |a Electric discharges. 
650 0 |a Electronic apparatus and appliances  |x Protection. 
650 0 |a Microelectronics. 
650 0 |a Static eliminators. 
650 0 |a Electrostatics. 
650 0 |a Electric action of points. 
650 6 |a Appareils électroniques  |x Conception et construction. 
650 6 |a Décharges électriques. 
650 6 |a Appareils électroniques  |x Protection. 
650 6 |a Microélectronique. 
650 6 |a Antistatiques. 
650 7 |a microelectronics.  |2 aat 
650 7 |a antistatic agent.  |2 aat 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Circuits  |x General.  |2 bisacsh 
650 7 |a Electric action of points  |2 fast 
650 7 |a Electric discharges  |2 fast 
650 7 |a Electronic apparatus and appliances  |x Design and construction  |2 fast 
650 7 |a Electronic apparatus and appliances  |x Protection  |2 fast 
650 7 |a Electrostatics  |2 fast 
650 7 |a Microelectronics  |2 fast 
650 7 |a Static eliminators  |2 fast 
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830 0 |a ESD series. 
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