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Modern electroplating.

Electroplating is the coating of an electrically conductive object with a layer of metal using electrical current resulting in a thin, smooth, even coat of metal on the object. This text covers the methods and applications of electrochemical deposition of metals, alloys, semiconductors, and conducti...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Paunovic, Milan, Schlesinger, Mordechay
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, NJ : Wiley, 2010.
Edición:5. ed.
Colección:ECS series of texts and monographs ; 52.
Temas:
Acceso en línea:Texto completo

MARC

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245 0 0 |a Modern electroplating. 
250 |a 5. ed. 
260 |a Hoboken, NJ :  |b Wiley,  |c 2010. 
300 |a 1 online resource (xv, 729 pages)  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
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347 |a data file  |2 rda 
490 1 |a The ECS series of texts and monographs ;  |v 52 
504 |a Includes bibliographical references and index. 
520 8 |a Electroplating is the coating of an electrically conductive object with a layer of metal using electrical current resulting in a thin, smooth, even coat of metal on the object. This text covers the methods and applications of electrochemical deposition of metals, alloys, semiconductors, and conductive polymers. It provides practical advice and some theoretical background to those entering the field of electrodeposition. Like previous editions, the fifth edition will be the first stop reference for the electroplating community. This fully updated edition includes significant advances in the field, from emerging electrodeposition techniques to electroplating in medical and data storage industries." 
505 0 |a MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS 
505 8 |a 12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 
505 8 |a 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX 
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650 0 |a Metals  |x Finishing. 
650 2 |a Electroplating 
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830 0 |a ECS series of texts and monographs ;  |v 52. 
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