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The Key to Technical Translation : Volume 1: Concept specification.

This handbook for German/English/German technical translators at all levels from student to professional covers the root terminologies of the spectrum of scientific and engineering fields. The work is designed to give technical translators direct insight into the main error sources occurring in thei...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Hann, Michael
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Amsterdam/Philadelphia : John Benjamins Publishing Company, 1992.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • THE KEY TO TECHNICAL TRANSLATION VOLUME ONE CONCEPT SPECIFICATION; Title page; Copyright page; ACKNOWLEDGEMENTS; PREFACE; VORWORT; Table of Contents; INTRODUCTION; 1. Layout; 2. Objectives; ACCESS GUIDE; 1. Translation Approaches; 2. Global Index; 3. Diagrams, Term lists; 4. Term Index; 5. Information Retrieval; Chapter One. PHYSICAL QUANTITIES; 1.1 Basic Derived Quantities; 1.1.1 Mass, Weight; 1.1.2 Work, Energy, Power; 1.13 Coulomb, Kelvin, Candela, Mol; 1.2 Scalar/Vector Quantities; 1.3 Magnitude, Direction; 1.4 Mechanical Quantities; 1.4.1 Speed, Velocity, Acceleration.
  • 1.4.2 Power, Performance, Efficiency1.4.3 Impulse, Momentum; 1.4.4 Stress, Strain, Tension; 1.4.5 Moment, Torque, Torsion; 1.5 Units, Symbols; Figure 1: Mechanical Quantities; Chapter Two. BASIC ELECTRICITY; 2.1 Voltage, Current; 2.2 Resistor, Resistance, Resistivity; 2.3 Direct/Altematíng Crrent (AC/DC; 2.4 Capacitor, Inductor, Transformer; 2.5 Power, Wattage, Rating; 2.6 Resistance, Reactance, Impedance; 2.7 Scalar/Phasor Quantities; 2.8 Transmission Cables; Figure 2A: Electrical Quantities; Figure 2B: Basic Electrical Terms; Chapter Three. MATERIALS SCIENCE.
  • 3.1 Atomic Number, Mass Number, Group Number3.2 Properties of Elements; 3.3 Isotope, Nuclide; 3.4 Atomic Bonding; 3.5 Ion, Plasma; 3.6 Material Properties; Figure 3A: Extract from the Periodic Table of Elements; Figure 3B: Common Elements; Figure 3C: Atomic Constituents/Interatomic Bonding; Chapter Four. NUCLEONICS; 4.1 Radioactivity; 4.2 Particulate/Electromagnetic Radiation; 4.2.1 Radiation Energy; 4.2.2 Wave/Particle Duality; 4.3 Radiosubstances; 4.4 Matter, Anti-Matter; 4.5 Fission, Fusion, Decay; 4.6 Nuclear Power; Figure 4A: Broad Electromagnetic Spectrum.
  • Figure 4B: Decay Transitions of U-238Figure 4C: Elementary Partìdes; Figure 4D: Oscillation/Wave/Radiation; Figure 4E: Nudear Fission/Fusion; Chapter Five. SEMICONDUCTORS; 5.1 Semiconductor Devices; 5.2 Semiconductor Materials; 5.2.1 Donor Injection, N-Type Zone; 522 Acceptor Injection, P-Type Zone; 5.2.3 Pn-Junctìon/Transition; 5.3 Conduction; 5.3.1 Intrinsic/Extrinsic Conduction; 5.3.2 Quantum Mechanics; 5.3.3 Energy Gap, Mobility; Figure 5: Semiconductor Materials; Chapter Six. ELECTRONICS; 6.1 Active/Passive Devices; 6.2 Modules, Discrete Components; 6.3 Transducers; 6.4 Switching Devices.
  • 6.5 Terminal, Lead, Electrode6.6 Heat Dissipation; 6.7 Device Parameters; Figure 6A: Electronic Circuit Devices/Modules; Figure 6B: Terminal/Lead/Electrode Designators; Figure 6C: Semiconductor Device Parameters/Terminology; Chapter Seven. ELECTRICAL ENGINEERING; 7.1 Engineer, Technologist, Technician; 7.2 Electrical/Electronic Equipment; 7.3 Circuit Technology; 7.4 Junction Devices; 7.4.1 Diode; 7.4.2 Transistor; 7.4.3 Thyristor; 7.5 Power Supply Unit; 7.6 Household Electrics; 7.7 Auto-Electrics; Figure 7A: Electric Motors; Figure 7B: Circuit Applications; Figure 7C: Power Supply/Circuitry.