Lead-free Solders : Materials Reliability for Electronics.

Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include: Alloy development Composite approa...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Subramanian, K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken : John Wiley & Sons, 2012.
Edición:2nd ed.
Temas:
Lead-free electronics manufacturing processes.
Solder and soldering.
Soudure.
solder.
Lead-free electronics manufacturing processes
Solder and soldering
Acceso en línea:Texto completo

MARC

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245 1 0 |a Lead-free Solders :  |b Materials Reliability for Electronics. 
250 |a 2nd ed. 
260 |a Hoboken :  |b John Wiley & Sons,  |c 2012. 
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505 0 |a Lead-free Solders: Materials Reliability for Electronics; Contents; Series Preface; Preface; List of Contributors; Thematic Area I: Introduction; 1 Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters; 1.1 Material Design for Reliable Lead-Free Electronic Solders Joints; 1.2 Imposed Fields and the Solder Joint Responses that Affect Their Reliability; 1.3 Mechanical Integrity; 1.4 Thermomechanical Fatigue (TMF); 1.5 Whisker Growth; 1.6 Electromigration (EM); 1.7 Thermomigration (TM); 1.8 Other Potential Issues. 
505 8 |a Thematic Area II: Phase Diagrams and Alloying Concepts2 Phase Diagrams and Their Applications in Pb-Free Soldering; 2.1 Introduction; 2.2 Phase Diagrams of Pb-Free Solder Systems; 2.3 Example of Applications; 2.3.1 General Applications (Melting, Solidification, Interfacial Reactions); 2.3.2 Effective Undercooling Reduction (Co Addition); 2.3.3 Unexpected Compound Formation (Sn-Ag/Cu Interfacial Reactions); 2.3.4 Unexpected Growth Rates (Sn-Bi/Fe and Sn-Pb/Fe); 2.3.5 Unexpected Melting of Solder (Sn-Sb/Ag); 2.3.6 Up-Hill Diffusion (Sn-Cu/Ni); 2.3.7 Limited Sn Supply (Au/Sn/Cu); 2.4 Conclusions. 
505 8 |a AcknowledgmentsReferences; 3 Phase Diagrams and Alloy Development; 3.1 Introduction; 3.2 Computational Thermodynamics as a Research Tool; 3.2.1 Concept of the Calculation of Phase Diagrams for Multicomponent Systems; 3.2.2 Modelling of the Gibbs Energy of the System; 3.2.3 Critical Assessment of Thermodynamic Properties; 3.3 Thermodynamic Databases -- the Underlying Basis of the Modelling of Phase Diagrams and Thermodynamic Properties, Databases for Lead-Free Solders; 3.3.1 Creation of the Thermodynamic Databases; 3.3.2 Three Conditions of Consistency. 
505 8 |a 3.3.3 Specialized Databases for the Modelling of Thermodynamic Properties of Systems Relevant for Lead-Free Solders3.4 Application of the SOLDERS Database to Alloy Development; 3.4.1 Modelling of Phase Diagrams and Thermodynamic Properties; 3.4.2 Modelling of Other Properties; 3.5 Conclusions; References; 4 Interaction of Sn-based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry; 4.1 Introduction; 4.2 Binary Phase Equilibria; 4.2.1 Literature Overview; 4.2.2 New Experimental Results; 4.3 Ternary Phase Equilibria Ni-P-Sn; 4.3.1 Literature Overview; 4.3.2 Experimental Results. 
505 8 |a 4.4 Thermochemical Data4.4.1 Literature Overview; 4.4.2 New Experimental Results; 4.5 Relevance of the Results and Conclusion; Acknowledgments; References; Thematic Area III: Microalloying to Improve Reliability; 5 'Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints'; 5.1 Introduction; 5.2 Controlling Ag?Sn Plate Formation; 5.3 Controlling the Undercooling of Sn Solidification; 5.4 Controlling Interfacial Reactions; 5.4.1 Dissolution of UBM and Surface Finishes; 5.4.2 Cu-Sn Intermetallic Formation; 5.4.3 Interfacial Void Formation. 
500 |a 5.4.4 Spalling of Ni-Sn Intermetallics. 
520 |a Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include: Alloy development Composite approaches (including nanoscale reinforcements) Thermomechanical fatigue Electromigration Whisker growth Reliability under impact loading Accelerated thermal cycling Long-term reliability High temperature lead-free solders Lead-free Solders: Materials Reliability for Electronics:€Provides a comprehen. 
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650 0 |a Lead-free electronics manufacturing processes. 
650 0 |a Solder and soldering. 
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650 7 |a Lead-free electronics manufacturing processes  |2 fast 
650 7 |a Solder and soldering  |2 fast 
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