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EBOOKCENTRAL_ocn779364376 |
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20240329122006.0 |
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m o d |
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120306s2011 ohua ob 101 0 eng d |
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| 019 |
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|a 923571072
|a 929147929
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|a 9781615038503
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|a (OCoLC)779364376
|z (OCoLC)923571072
|z (OCoLC)929147929
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| 050 |
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4 |
|a TK7801
|b .A241 2011eb
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| 072 |
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|a TEC
|x 008060
|2 bisacsh
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|2 bisacsh
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|a 621.381
|2 23
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| 049 |
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|a UAMI
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| 111 |
2 |
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|a International Symposium for Testing and Failure Analysis
|n (37th :
|d 2011 :
|c San Jose, Calif.)
|
| 245 |
1 |
0 |
|a ISTFA 2011 :
|b conference proceedings from the 37th International Symposium for Testing and Failure Analysis, November 13-17, 2011, San Jose Convention Center, San Jose, California /
|c sponsored by EDFAS, ISTFA/2011, ASM International.
|
| 246 |
3 |
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|a International Symposium for Testing and Failure Analysis 2011
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| 246 |
3 |
0 |
|a Conference proceedings of the 37th International Symposium for Testing and Failure Analysis
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| 246 |
3 |
0 |
|a 37th International Symposium for Testing and Failure Analysis
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| 246 |
3 |
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|a Thirty-seventh International Symposium for Testing and Failure Analysis
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| 260 |
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|a Materials Park, OH :
|b ASM International,
|c 2011.
|
| 300 |
|
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|a 1 online resource (xix, 456 pages) :
|b illustrations
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| 336 |
|
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|a text
|b txt
|2 rdacontent
|
| 337 |
|
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|a computer
|b c
|2 rdamedia
|
| 338 |
|
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|a online resource
|b cr
|2 rdacarrier
|
| 500 |
|
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|a Some online versions lack accompanying media packaged with the printed version.
|
| 504 |
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|a Includes bibliographical references and index.
|
| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a Title Page -- Copyright -- Contents -- IPFA 2011 Best Paper -- Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation -- Session 1: Emerging FA Techniques and Concepts -- A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response -- Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing -- Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology
|
| 505 |
8 |
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|a Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron MicroscopyCorrecting for spherical aberrations in solid immersion microscopy using a deformable mirror -- Session 2: Circuit Edit -- The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors -- State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance -- Neon Ion Microscope Nanomachining Considerations
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| 505 |
8 |
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|a Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methodsCircuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes -- Session 3: Packaging and Assembly Level FA I -- 3DIC Fault Isolation Using the OBIRCH Approach -- Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds -- Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology
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| 505 |
8 |
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|a Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in ThermographyFailure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique -- Session 4: Test and Diagnostics -- Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis -- Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis -- Debugging an Invisible Flaky Scan Chain Defect -- Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree -- Session 5: Defect Characterization and Metrology
|
| 505 |
8 |
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|a A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA TechniquesAl Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe -- Whisker Formation in Copper Electroplating -- Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study -- Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding -- Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique
|
| 590 |
|
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
| 590 |
|
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 590 |
|
|
|a Knovel
|b ACADEMIC - Nondestructive Testing & Evaluation
|
| 650 |
|
0 |
|a Electronics
|x Materials
|x Testing
|v Congresses.
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
|
| 650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Congrès.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Digital.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Microelectronics.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing
|2 fast
|
| 650 |
|
7 |
|a Electronics
|x Materials
|x Testing
|2 fast
|
| 653 |
1 |
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|a Testing analysis
|
| 655 |
|
7 |
|a Conference papers and proceedings
|2 fast
|
| 710 |
2 |
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|a Electronic Device Failure Analysis Society.
|
| 710 |
2 |
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|a International Symposium for Testing and Failure Analysis/2011.
|
| 710 |
2 |
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|a ASM International.
|
| 776 |
0 |
8 |
|i Print version:
|a International Symposium for Testing and Failure Analysis (37th : 2011 : San Jose, Calif.).
|t ISTFA 2011.
|d Materials Park, OH : ASM International, 2011
|z 9781615038268
|w (OCoLC)769470020
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=3002459
|z Texto completo
|
| 938 |
|
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|a EBL - Ebook Library
|b EBLB
|n EBL3002459
|
| 938 |
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|a EBSCOhost
|b EBSC
|n 438625
|
| 938 |
|
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|a YBP Library Services
|b YANK
|n 7501515
|
| 994 |
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|a 92
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