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Handbook of Wafer Bonding.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken :
John Wiley & Sons,
2011.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Handbook of Wafer Bonding; Contents; Preface; Obituary; List of Contributors; Introduction; Part One: Technologies; A. Adhesive and Anodic Bonding; 1: Glass Frit Wafer Bonding; 1.1 Principle of Glass Frit Bonding; 1.2 Glass Frit Materials; 1.3 Screen Printing: Process for Bringing Glass Frit Material onto Wafers; 1.4 Thermal Conditioning: Process for Transforming Printed Paste into Glass for Bonding; 1.5 Wafer Bond Process: Essential Wafer-to-Wafer Mounting by a Glass Frit Interlayer; 1.6 Characterization of Glass Frit Bonds; 1.7 Applications of Glass Frit Wafer Bonding; 1.8 Conclusions.
- 3.3.1 Polymer Adhesive Wafer Bonding Process3.3.2 Localized Polymer Adhesive Wafer Bonding; 3.4 Wafer-to-Wafer Alignment in Polymer Adhesive Wafer Bonding; 3.5 Examples for Polymer Adhesive Wafer Bonding Processes and Programs; 3.5.1 Bonding with Thermosetting Polymers for Permanent Wafer Bonds (BCB) or for Temporary Wafer Bonds (mr-I 9000); 3.5.2 Bonding with Thermoplastic Polymer (HD-3007) for Temporary and Permanent Wafer Bonds; 3.6 Summary and Conclusions; References; 4: Anodic Bonding; 4.1 Introduction; 4.2 Mechanism of Anodic Bonding; 4.2.1 Glass Polarization.
- 4.2.2 Achieving Intimate Contact4.2.3 Interface Reactions; 4.3 Bonding Current; 4.4 Glasses for Anodic Bonding; 4.5 Characterization of Bond Quality; 4.6 Pressure Inside Vacuum-Sealed Cavities; 4.7 Effect of Anodic Bonding on Flexible Structures; 4.8 Electrical Degradation of Devices during Anodic Bonding; 4.8.1 Degradation by Sodium Contamination; 4.8.2 Degradation by High Electric Fields; 4.9 Bonding with Thin Films; 4.10 Conclusions; References; B. Direct Wafer Bonding; 5: Direct Wafer Bonding; 5.1 Introduction; 5.2 Surface Chemistry and Physics; 5.3 Wafer Bonding Techniques.
- 5.3.1 Hydrophilic Wafer Bonding5.3.2 Hydrophobic Wafer Bonding; 5.3.3 Low-Temperature Wafer Bonding; 5.3.4 Wafer Bonding in Ultrahigh Vacuum; 5.4 Properties of Bonded Interfaces; 5.5 Applications of Wafer Bonding; 5.5.1 Advanced Substrates for Microelectronics; 5.5.2 MEMS and Nanoelectromechanical Systems; 5.6 Conclusions; References; 6: Plasma-Activated Bonding; 6.1 Introduction; 6.2 Theory; 6.2.1 (Silicon) Direct Bonding; 6.2.2 Mechanisms of Plasma on Silicon Surfaces; 6.2.3 Physical Definition of a Plasma; 6.3 Classification of PAB; 6.3.1 Low-Pressure PAB; 6.3.2 Atmospheric-Pressure PAB.