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OCoLC |
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20240329122006.0 |
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m o d |
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120206s2011 xx o 000 0 eng d |
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|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d IDEBK
|d OCLCQ
|d DEBSZ
|d OCLCQ
|d EBLCP
|d ZCU
|d OCLCQ
|d MERUC
|d ICG
|d OCLCQ
|d DKC
|d OCLCQ
|d HS0
|d OCLCO
|d OCLCF
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
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|a 9783527644247
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|a 3527644245
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|a AU@
|b 000055790885
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|a DEBBG
|b BV044160318
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|a DEBSZ
|b 431074313
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|a (OCoLC)775301857
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|a QC611.6.S9 H36 2011
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|a 621.38152
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|a UAMI
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| 100 |
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|a Ramm, Peter.
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| 245 |
1 |
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|a Handbook of Wafer Bonding.
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| 260 |
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|a Hoboken :
|b John Wiley & Sons,
|c 2011.
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| 300 |
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|a 1 online resource (430 pages)
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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|a Handbook of Wafer Bonding; Contents; Preface; Obituary; List of Contributors; Introduction; Part One: Technologies; A. Adhesive and Anodic Bonding; 1: Glass Frit Wafer Bonding; 1.1 Principle of Glass Frit Bonding; 1.2 Glass Frit Materials; 1.3 Screen Printing: Process for Bringing Glass Frit Material onto Wafers; 1.4 Thermal Conditioning: Process for Transforming Printed Paste into Glass for Bonding; 1.5 Wafer Bond Process: Essential Wafer-to-Wafer Mounting by a Glass Frit Interlayer; 1.6 Characterization of Glass Frit Bonds; 1.7 Applications of Glass Frit Wafer Bonding; 1.8 Conclusions.
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| 504 |
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|a References2: Wafer Bonding Using Spin-On Glass as Bonding Material; 2.1 Spin-On Glass Materials; 2.2 Wafer Bonding with SOG Layers; 2.2.1 Experimental; 2.2.2 Wafer Bonding with Silicate SOG Layers; 2.2.3 Wafer Bonding with Planarization SOG; 2.2.4 Applications of Adhesive Wafer Bonding with SOG Layers; 2.2.5 Conclusion; References; 3: Polymer Adhesive Wafer Bonding; 3.1 Introduction; 3.2 Polymer Adhesives; 3.2.1 Polymer Adhesion Mechanisms; 3.2.2 Properties of Polymer Adhesives; 3.2.3 Polymer Adhesives for Wafer Bonding; 3.3 Polymer Adhesive Wafer Bonding Technology.
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|a 3.3.1 Polymer Adhesive Wafer Bonding Process3.3.2 Localized Polymer Adhesive Wafer Bonding; 3.4 Wafer-to-Wafer Alignment in Polymer Adhesive Wafer Bonding; 3.5 Examples for Polymer Adhesive Wafer Bonding Processes and Programs; 3.5.1 Bonding with Thermosetting Polymers for Permanent Wafer Bonds (BCB) or for Temporary Wafer Bonds (mr-I 9000); 3.5.2 Bonding with Thermoplastic Polymer (HD-3007) for Temporary and Permanent Wafer Bonds; 3.6 Summary and Conclusions; References; 4: Anodic Bonding; 4.1 Introduction; 4.2 Mechanism of Anodic Bonding; 4.2.1 Glass Polarization.
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|a 4.2.2 Achieving Intimate Contact4.2.3 Interface Reactions; 4.3 Bonding Current; 4.4 Glasses for Anodic Bonding; 4.5 Characterization of Bond Quality; 4.6 Pressure Inside Vacuum-Sealed Cavities; 4.7 Effect of Anodic Bonding on Flexible Structures; 4.8 Electrical Degradation of Devices during Anodic Bonding; 4.8.1 Degradation by Sodium Contamination; 4.8.2 Degradation by High Electric Fields; 4.9 Bonding with Thin Films; 4.10 Conclusions; References; B. Direct Wafer Bonding; 5: Direct Wafer Bonding; 5.1 Introduction; 5.2 Surface Chemistry and Physics; 5.3 Wafer Bonding Techniques.
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| 505 |
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|a 5.3.1 Hydrophilic Wafer Bonding5.3.2 Hydrophobic Wafer Bonding; 5.3.3 Low-Temperature Wafer Bonding; 5.3.4 Wafer Bonding in Ultrahigh Vacuum; 5.4 Properties of Bonded Interfaces; 5.5 Applications of Wafer Bonding; 5.5.1 Advanced Substrates for Microelectronics; 5.5.2 MEMS and Nanoelectromechanical Systems; 5.6 Conclusions; References; 6: Plasma-Activated Bonding; 6.1 Introduction; 6.2 Theory; 6.2.1 (Silicon) Direct Bonding; 6.2.2 Mechanisms of Plasma on Silicon Surfaces; 6.2.3 Physical Definition of a Plasma; 6.3 Classification of PAB; 6.3.1 Low-Pressure PAB; 6.3.2 Atmospheric-Pressure PAB.
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|a 6.4 Procedure of PAB.
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| 500 |
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|a Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
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| 588 |
0 |
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|a Print version record.
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| 590 |
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
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| 650 |
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0 |
|a Semiconductors
|x Bonding
|v Handbooks, manuals, etc.
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| 650 |
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0 |
|a Semiconductor wafers.
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| 650 |
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0 |
|a Microelectromechanical systems
|x Design and construction.
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| 650 |
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4 |
|a Semiconductors
|x Surfaces
|x Cleaning.
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| 650 |
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4 |
|a Science.
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| 650 |
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4 |
|a Physics.
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| 650 |
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4 |
|a Engineering.
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| 650 |
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4 |
|a Electrical engineering.
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| 650 |
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6 |
|a Plaquettes à gravure en semi-conducteurs.
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| 650 |
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7 |
|a Microelectromechanical systems
|x Design and construction
|2 fast
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| 650 |
|
7 |
|a Semiconductor wafers
|2 fast
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| 650 |
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7 |
|a Semiconductors
|x Bonding
|2 fast
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| 655 |
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7 |
|a Handbooks and manuals
|2 fast
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| 700 |
1 |
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|a Lu, James Jian-Qiang.
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| 700 |
1 |
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|a Taklo, Maaike M. V.
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| 758 |
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|i has work:
|a Handbook of wafer bonding (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCGhFWRkyyvtvRCTvKP4KBP
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|a Ramm, Peter.
|t Handbook of Wafer Bonding.
|d Hoboken : John Wiley & Sons, ©2011
|z 9783527326464
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| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=822735
|z Texto completo
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| 938 |
|
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|a EBL - Ebook Library
|b EBLB
|n EBL4042305
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| 938 |
|
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|a EBL - Ebook Library
|b EBLB
|n EBL822735
|
| 938 |
|
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|a ProQuest MyiLibrary Digital eBook Collection
|b IDEB
|n 363975
|
| 994 |
|
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|a 92
|b IZTAP
|
