Handbook of Wafer Bonding.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Ramm, Peter
Otros Autores: Lu, James Jian-Qiang, Taklo, Maaike M. V.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken : John Wiley & Sons, 2011.
Temas:
Semiconductors > Bonding > Handbooks, manuals, etc.
Semiconductor wafers.
Microelectromechanical systems > Design and construction.
Semiconductors > Surfaces > Cleaning.
Science.
Physics.
Engineering.
Electrical engineering.
Plaquettes à gravure en semi-conducteurs.
Microelectromechanical systems > Design and construction
Semiconductor wafers
Semiconductors > Bonding
Handbooks and manuals
Acceso en línea:Texto completo
Descripción
Notas:6.4 Procedure of PAB.
Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
Descripción Física:1 online resource (430 pages)
Bibliografía:References2: Wafer Bonding Using Spin-On Glass as Bonding Material; 2.1 Spin-On Glass Materials; 2.2 Wafer Bonding with SOG Layers; 2.2.1 Experimental; 2.2.2 Wafer Bonding with Silicate SOG Layers; 2.2.3 Wafer Bonding with Planarization SOG; 2.2.4 Applications of Adhesive Wafer Bonding with SOG Layers; 2.2.5 Conclusion; References; 3: Polymer Adhesive Wafer Bonding; 3.1 Introduction; 3.2 Polymer Adhesives; 3.2.1 Polymer Adhesion Mechanisms; 3.2.2 Properties of Polymer Adhesives; 3.2.3 Polymer Adhesives for Wafer Bonding; 3.3 Polymer Adhesive Wafer Bonding Technology.
ISBN:9783527644247
3527644245

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