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Ceramic Integration and Joining Technologies : From Macro to Nanoscale.

This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integr...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Singh, M. (Mrityunjay) (Editor ), Ohji, T. (Tatsuki) (Editor ), Asthana, R. (Rajiv) (Editor ), Mathur, Sanjay (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Wiley-American Ceramic Society 2011.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • CERAMIC INTEGRATION AND JOINING TECHNOLOGIES: From Macro to Nanoscale; CONTENTS; PREFACE; CONTRIBUTORS; PART I: INTRODUCTION; 1: CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES; PART II: SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION; 2: CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES; 3: JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY; 4: AIR BRAZING: A NEW METHOD OF CERAMIC-CERAMIC AND CERAMIC-METAL JOINING
  • 5: DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS6: INTEGRATION OF CARBON-CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS; 7: CONTACT INTERACTION IN CARBON-METAL SYSTEMS FOR JOINING AND INTEGRATION; PART III: INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION; 8: INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS; 9: OXIDE THERMOELECTRIC POWER GENERATION; 10: INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS
  • 11: INTEGRATION TECHNOLOGIES FOR SENSORS12: ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS; 13: INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION; 14: THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY; 15: INTEGRATION ISSUES OF BARIUM STRONTIUM TITANA TETHIN FILM FOR TUNABLE MICROWAVE APPLICATIONS; 16: AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES; PART IV: NANO- AND BIOINTEGRATION
  • 17: ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY18: INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES; 19: INTEGRATING DIAMOND LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS); 20: SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES; 21: NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY; 22: MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS
  • 23: USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS24: BIOINTEGRATION OF PROSTHETIC DEVICES; INDEX