Lead-free solder interconnect reliability /

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Shangguan, Dongkai, 1963-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Materials Park, OH : ASM International, 2005.
Temas:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
Mise sous boîtier (Microélectronique) > Fiabilité.
Soudure.
solder.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
Lead-free electronics manufacturing processes
Microelectronic packaging > Reliability
Solder and soldering
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Contents
  • Foreword
  • Preface
  • Lead-Free Soldering and Environmental Compliance: An Overview
  • Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects
  • Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties
  • Lead-Free Solder Joint Reliability Trends
  • Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects
  • Tin Whisker Growth on Lead-Free Solder Finishes
  • Accelerated Testing Methodology for Lead-Free Solder Interconnects
  • Thermomechanical Reliability Prediction of Lead-Free Solder InterconnectsDesign for Reliabilityâ€?Finite Element Modeling of Lead-Free Solder Interconnects
  • Characterization and Failure Analyses of Lead-Free Solder Defects
  • Reliability of Interconnects with Conductive Adhesives
  • Lead-Free Solder Interconnect Reliability Outlook
  • Index

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