|
|
|
|
| LEADER |
00000cam a2200000 a 4500 |
| 001 |
EBOOKCENTRAL_ocn729262390 |
| 003 |
OCoLC |
| 005 |
20240329122006.0 |
| 006 |
m o d |
| 007 |
cr cn||||||||| |
| 008 |
110606s2005 ohua ob 001 0 eng d |
| 010 |
|
|
|z 2005050106
|
| 040 |
|
|
|a KNOVL
|b eng
|e pn
|c KNOVL
|d OCLCQ
|d YDXCP
|d N$T
|d OCLCE
|d E7B
|d COO
|d B24X7
|d OCLCQ
|d KNOVL
|d ZCU
|d KNOVL
|d OCLCF
|d OCLCQ
|d KNOVL
|d CNNAI
|d EBLCP
|d OCLCQ
|d DEBSZ
|d OCLCQ
|d AZK
|d LOA
|d JBG
|d AGLDB
|d MOR
|d PIFAG
|d MERUC
|d OCLCQ
|d U3W
|d BUF
|d COD
|d STF
|d WRM
|d VTS
|d CEF
|d NRAMU
|d RRP
|d ICG
|d INT
|d VT2
|d AU@
|d OCLCQ
|d WYU
|d OCLCQ
|d UWW
|d DKC
|d OCLCQ
|d M8D
|d OCLCQ
|d UKCRE
|d MM9
|d EYM
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCL
|
| 019 |
|
|
|a 297986526
|a 764524457
|a 765135765
|a 858447454
|a 961570639
|a 962630422
|a 966147955
|a 988486457
|a 991914008
|a 999667400
|a 1037907637
|a 1038662416
|a 1045505736
|a 1055385671
|a 1060198896
|a 1064737787
|a 1081281043
|a 1087369832
|a 1124346248
|a 1153517311
|a 1194737472
|
| 020 |
|
|
|a 9781615030934
|q (electronic bk.)
|
| 020 |
|
|
|a 161503093X
|q (electronic bk.)
|
| 020 |
|
|
|z 9780871708168
|
| 020 |
|
|
|z 0871708167
|
| 029 |
1 |
|
|a AU@
|b 000047057176
|
| 029 |
1 |
|
|a AU@
|b 000050966662
|
| 029 |
1 |
|
|a AU@
|b 000051377509
|
| 029 |
1 |
|
|a DEBBG
|b BV043153772
|
| 029 |
1 |
|
|a DEBBG
|b BV044182322
|
| 029 |
1 |
|
|a DEBSZ
|b 421522615
|
| 029 |
1 |
|
|a DEBSZ
|b 449508846
|
| 029 |
1 |
|
|a NZ1
|b 13860878
|
| 029 |
1 |
|
|a NZ1
|b 15621525
|
| 035 |
|
|
|a (OCoLC)729262390
|z (OCoLC)297986526
|z (OCoLC)764524457
|z (OCoLC)765135765
|z (OCoLC)858447454
|z (OCoLC)961570639
|z (OCoLC)962630422
|z (OCoLC)966147955
|z (OCoLC)988486457
|z (OCoLC)991914008
|z (OCoLC)999667400
|z (OCoLC)1037907637
|z (OCoLC)1038662416
|z (OCoLC)1045505736
|z (OCoLC)1055385671
|z (OCoLC)1060198896
|z (OCoLC)1064737787
|z (OCoLC)1081281043
|z (OCoLC)1087369832
|z (OCoLC)1124346248
|z (OCoLC)1153517311
|z (OCoLC)1194737472
|
| 037 |
|
|
|b Knovel Corporation
|n http://www.knovel.com
|
| 050 |
|
4 |
|a TK7870.15
|b .L425 2005eb
|
| 072 |
|
7 |
|a TEC
|x 008060
|2 bisacsh
|
| 072 |
|
7 |
|a TEC
|x 008070
|2 bisacsh
|
| 082 |
0 |
4 |
|a 621.381/046
|2 22
|
| 049 |
|
|
|a UAMI
|
| 245 |
0 |
0 |
|a Lead-free solder interconnect reliability /
|c edited by Dongkai Shangguan.
|
| 260 |
|
|
|a Materials Park, OH :
|b ASM International,
|c 2005.
|
| 300 |
|
|
|a 1 online resource (x, 292 pages) :
|b illustrations
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 504 |
|
|
|a Includes bibliographical references and index.
|
| 588 |
0 |
|
|a Print version record.
|
| 505 |
0 |
|
|a Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects
|
| 505 |
8 |
|
|a Thermomechanical Reliability Prediction of Lead-Free Solder InterconnectsDesign for Reliability�Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index
|
| 590 |
|
|
|a Knovel
|b ACADEMIC - Metals & Metallurgy
|
| 590 |
|
|
|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 590 |
|
|
|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
| 650 |
|
0 |
|a Microelectronic packaging
|x Reliability.
|
| 650 |
|
0 |
|a Solder and soldering.
|
| 650 |
|
0 |
|a Lead-free electronics manufacturing processes.
|
| 650 |
|
6 |
|a Mise sous boîtier (Microélectronique)
|x Fiabilité.
|
| 650 |
|
6 |
|a Soudure.
|
| 650 |
|
7 |
|a solder.
|2 aat
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Digital.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Microelectronics.
|2 bisacsh
|
| 650 |
|
7 |
|a Lead-free electronics manufacturing processes
|2 fast
|
| 650 |
|
7 |
|a Microelectronic packaging
|x Reliability
|2 fast
|
| 650 |
|
7 |
|a Solder and soldering
|2 fast
|
| 700 |
1 |
|
|a Shangguan, Dongkai,
|d 1963-
|
| 758 |
|
|
|i has work:
|a Lead-free solder interconnect reliability (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCFJKfFcrBx987FP9Pvk8T3
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|t Lead-free solder interconnect reliability.
|d Materials Park, OH : ASM International, 2005
|z 0871708167
|w (DLC) 2005050106
|w (OCoLC)60543308
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=3002391
|z Texto completo
|
| 938 |
|
|
|a Books 24x7
|b B247
|n bke00042657
|
| 938 |
|
|
|a EBL - Ebook Library
|b EBLB
|n EBL3002391
|
| 938 |
|
|
|a ebrary
|b EBRY
|n ebr10320384
|
| 938 |
|
|
|a EBSCOhost
|b EBSC
|n 395879
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 3623549
|
| 994 |
|
|
|a 92
|b IZTAP
|
