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Understanding signal integrity /
This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, inclu...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston :
Artech House,
©2011.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Thierauf, Stephen C. | |
| 245 | 1 | 0 | |a Understanding signal integrity / |c Stephen C. Thierauf. |
| 260 | |a Boston : |b Artech House, |c ©2011. | ||
| 300 | |a 1 online resource (xvi, 239 pages) | ||
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| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 520 | 3 | |a This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists. This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter. |c Publisher abstract. | |
| 505 | 0 | |a Understanding Signal Integrity; Contents; Preface; Chapter 1: Introduction to Signal Integrity; Chapter 2: The Signal Integrity Process; Chapter 3: Signal Integrity CAD and Models; Chapter 4: Printed Test and Evaluation Boards; Chapter 5: Printed Circuit Board Construction; Chapter 6: Transmission Line Fundamentals; Chapter 7: Understanding Microstrip and Stripline Transmission Lines; Chapter 8: Signal Loss and the Effects of Circuit Board Physical Factors; Chapter 9: Understanding Trace-to-Trace Coupling; Chapter 10: Understanding Crosstalk; Chapter 11: Understanding Signal Reflections | |
| 505 | 8 | |a Chapter 12: Termination StrategiesChapter 13: Differential Signaling; Chapter 14: Trace and Via Artwork Considerations for Signal Integrity; Chapter 15: Identifying Common Signal Integrity Problems; Chapter 16: Solving Common Signal Integrity Problems; Chapter 17: Calculating Trace and Plane Electrical Values; About the Author; Index | |
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| 650 | 6 | |a Intégrité de signal (Électronique) | |
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| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Signals & Signal Processing. |2 bisacsh | |
| 650 | 7 | |a Signal integrity (Electronics) |2 fast | |
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| 776 | 0 | 8 | |i Print version: |a Thierauf, Stephen C. |t Understanding signal integrity. |d Boston : Artech House, ©2011 |z 1596939818 |w (OCoLC)655250510 |
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