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Design of high-speed communication circuits /

MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased signifi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: World Scientific (Firm)
Otros Autores: Harjani, Ramesh, 1959-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Singapore ; Hackensack, N.J. : World Scientific, ©2006.
Colección:Selected topics in electronics and systems ; v. 38.
Temas:
Acceso en línea:Texto completo

MARC

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245 0 0 |a Design of high-speed communication circuits /  |c editor, Ramesh Harjani. 
260 |a Singapore ;  |a Hackensack, N.J. :  |b World Scientific,  |c ©2006. 
300 |a 1 online resource (vii, 222 pages) :  |b illustrations 
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490 1 |a Selected topics in electronics and systems ;  |v v. 38 
504 |a Includes bibliographical references. 
505 0 |a Achieving analog accuracy in nanometer CMOS / M.P. Flynn, S. Park and C.C. Lee -- Self-induced noise in integrated circuits / R. Gharpurey and S. Naraghi -- High-speed oversampling analog-to-digital converters / A. Gharbiya, T.C. Caldwell and D.A. Johns -- Designing LC VCOs using capacitive degeneration techniques / B. Jung and R. Harjani -- Fully integrated frequency synthesizers: a tutorial / S.T. Moon, A.Y. Valero-López and E. Sánchez-Sinencio -- Recent advances and design trends in CMOS radio frequency integrated circuits / D.J. Allstot [and others] -- Equalizers for high-speed serial links / P.K. Hanumolu, G.-Y. Wei and U.-K. Moon -- Low-power, parallel interface with continuous-time adaptive passive equalizer and crosstalk cancellation / C.P. Yue [and others]. 
520 |a MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible. The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O. 
588 0 |a Print version record. 
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