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|a Compound semiconductor integrated circuits /
|c editor, Tho T. Vu.
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|a River Edge, NJ :
|b World Scientific Pub.,
|c ©2003.
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|a 1 online resource (xii, 349 pages) :
|b illustrations
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|a Selected topics in electronics and systems ;
|v vol. 29
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|a Includes bibliographical references.
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|a Print version record.
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|a Annotation Book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits.
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|a Preface; CONTENTS; Present and Future of High-Speed Compound Semiconductor IC's; 1. Introduction; 2. Fundamentals of Lightwave Communication ICs; 3. Device Technology; 4. Fundamentals of High-Speed Digital IC Design; 5. Mixed Signal Issues in High Speed IC Design; 6. Future Trends and Subjects; 7. Conclusions; References; A Comparison of Silicon and III-V Technology Performance and Building Block Implementations for 10 and 40 Gb/s Optical Networking ICs; 1. Introduction; 2. Semiconductor Technologies; 3. Building Blocks; 4. Technology Choices; 5. Examples of 10 and 40 Gb/s Circuits.
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|a 6. ConclusionsReferences; The Transforming MMIC; 1. Introduction; 2. Transforming MMICs through Innovations in Compound Semiconductor Materials; 3. Transforming Architectures for Real-time Adaptability; 4. Conclusions; Reference; Metamorphic Low Noise Amplifiers and Optical Components; 1. Introduction; 2. Material Properties; 3. Device Processing and Low Noise DC Performance; 4. Low Noise Devices And Circuits; 5. Power Devices; 6. Metamorphic Optical Devices and Circuits; 7. Reliability; 8. Conclusion; References; GaAs PHEMT Chip Sets and IC Processes for High-End Fiber Optic Applications.
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505 |
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|a 1. Introduction2. PHEMT and MHEMT Processes; 3. Optical Fibre Interface Circuits; 4. 2.5 Gb/s Transimpedance Amplifiers; 5. 40Gb/s Transimpedance Amplifier; 6.10 Gb/s Laser Drivers; 7. 40Gb/s Modulator Drivers; 8.43 Gb/s Multiplexers and Demultiplexers; 9. Future Performance of Fiber Optic IC's and Related Processes; 10. Conclusion; References; Distributed Amplifier for Fiber-Optic Communication Systems; 1. Introduction; 2. Conventional Distributed Amplifier Design; 3. LiNbO3 Modulator Driver (LNDRV); 4. NRZ-Preamplifier; 5. RZ-Preamplifler; 6. Over-40-Gb/s amplifier; 7. Conclusion.
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|a 3. Trench Photodiodes4. Key Passive Elements for High-Frequency Operation; 5. Substrate Effects in RF and Microwave IC Designs; 6. Summary; References; High-Speed Low-Power Digital and Analog Circuits Implemented in IBM SiGe BiCMOS Technology; 1. Introduction; 2. Circuit design methodology; 3. Measured performance results from the first 5HP fabrication run; 4. Measured performance results from the second 5HP fabrication run; 5. Measured and simulated performance results on the first 7HP fabrication run; 6. Circuits placed on second 7HP fabrication run; 7. SiGe BiCMOS applications; 8. Summary.
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|a English.
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|b EBSCO eBook Subscription Academic Collection - Worldwide
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
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|a Compound semiconductors.
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|a Integrated circuits.
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|a Composés semi-conducteurs.
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|a Circuits intégrés.
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Solid State.
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Semiconductors.
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|a Compound semiconductors
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|a Integrated circuits
|2 fast
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|a Vu, T. T.
|q (Tho T.)
|1 https://id.oclc.org/worldcat/entity/E39PCjKQdY8QgtDbkkWQXvMqpK
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|a Compound semiconductor integrated circuits (Text)
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|t Compound semiconductor integrated circuits.
|d River Edge, NJ : World Scientific Pub., ©2003
|z 9812383115
|z 9789812383112
|w (DLC) 2003043280
|w (OCoLC)51756026
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830 |
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|a Selected topics in electronics and systems ;
|v v. 29.
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