Adaptive cooling of integrated circuits using digital microfluidics /

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Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power diss...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Paik, Philip Y.
Otros Autores: Chakrabarty, Krishnendu, Pamula, Vamsee K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood, Mass. : Artech House, ©2007.
Colección:Artech House integrated microsystems series.
Temas:
Integrated circuits > Cooling.
Microfluidics.
Integrated circuits > Design and construction.
Microfluidique.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Material Science.
Integrated circuits > Cooling
Integrated circuits > Design and construction
Microfluidics
Circuits intégrés > Refroidissement.
Microfluidique > Applications industrielles.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167.

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