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|a Numerical methods in thermal management of electronic systems /
|c guest editor, Professor K.N. Seetharamu.
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|a Bradford, England :
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|c ©2005.
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|a EDITORIAL ADVISORY BOARD; Editorial; Analysis and optimization of the thermal performance of microchannel heat sinks; Optimization of thermal resistance of stacked micro-channel using genetic algorithms; Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM; Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages; Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS).
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|a Numerical methods in thermal management of electronic systemsThis special issue brings together a number of papers dealing with the topic of heatand fluid flow, which are important in the thermal management of electronic systems. As the miniaturization of the electronic systems is proceeding at a rapid rate, thethermal problems are becoming more acute as they affect the performance and thereliability of the product.
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|a Seetharamu, K. N.
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