Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging /

This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presen...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Bailey, C. (Chris), Liu, Johan
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Bradford, England : Emerald Group Pub., ©2006.
Colección:Soldering & surface mount technology ; v. 18, no. 2.
Temas:
Manufacturing processes.
Electronic packaging.
Fabrication.
Mise sous boîtier (Électronique)
manufacturing.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic packaging
Manufacturing processes
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder.

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