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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging /
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presen...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Bradford, England :
Emerald Group Pub.,
©2006.
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| Colección: | Soldering & surface mount technology ;
v. 18, no. 2. |
| Temas: | |
| Acceso en línea: | Texto completo |