Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging /

This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presen...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Bailey, C. (Chris), Liu, Johan
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Bradford, England : Emerald Group Pub., ©2006.
Colección:Soldering & surface mount technology ; v. 18, no. 2.
Temas:
Manufacturing processes.
Electronic packaging.
Fabrication.
Mise sous boîtier (Électronique)
manufacturing.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic packaging
Manufacturing processes
Acceso en línea:Texto completo
Descripción
Sumario:This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Descripción Física:1 online resource (72 pages)
Bibliografía:Includes bibliographical references.
ISBN:184663010X
9781846630101
1846630118
9781846630118
ISSN:0954-0911 ;

Ejemplares similares