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Solder Joint Reliability /
The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with particular emphasis on long term, high reliability applications. Comparison of key mechanical properties indicates generally be...
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Bradford, England :
Emerald Group,
2004.
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| Colección: | Soldering and Surface Mount Technology.
v. 16. |
| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with particular emphasis on long term, high reliability applications. Comparison of key mechanical properties indicates generally beneficial outcomes of the transition to lead-free alloys, although there is a lack of understanding surroundingˆanomalous'' observations, such as the effects of the bismuth. The lower melting point of Sn-Zn-Bi alloys, together with their comparable mechanical properties, provide further impetus to ad. |
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| Descripción Física: | 1 online resource (91 pages) |
| Bibliografía: | Includes bibliographical references. |
| ISBN: | 086176966X 9780861769667 1845444140 9781845444143 1280515538 9781280515538 9786610515530 6610515530 |