Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Tan, Cher Ming (Autor), He, Feifei (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Singapore : Springer Nature Singapore : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:SpringerBriefs in Reliability,
Temas:
Security systems.
Electronic circuits.
Atoms.
Molecules.
Security Science and Technology.
Electronic Circuits and Systems.
Atomic, Molecular and Chemical Physics.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction
  • 3D Circuit Model Construction and Simulation
  • Comparison of EM Performance in Circuit Structure and Test Structure
  • Interconnect EM Reliability Modeling at Circuit Layout Level
  • Conclusion.

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