Electromigration Modeling at Circuit Layout Level
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has...
Clasificación: | Libro Electrónico |
---|---|
Autores principales: | Tan, Cher Ming (Autor), He, Feifei (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2013.
|
Edición: | 1st ed. 2013. |
Colección: | SpringerBriefs in Reliability,
|
Temas: | |
Acceso en línea: | Texto Completo |
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