Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Tan, Cher Ming (Autor), He, Feifei (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Singapore : Springer Nature Singapore : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:SpringerBriefs in Reliability,
Temas:
Security systems.
Electronic circuits.
Atoms.
Molecules.
Security Science and Technology.
Electronic Circuits and Systems.
Atomic, Molecular and Chemical Physics.
Acceso en línea:Texto Completo

MARC

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250 |a 1st ed. 2013. 
264 1 |a Singapore :  |b Springer Nature Singapore :  |b Imprint: Springer,  |c 2013. 
300 |a IX, 103 p. 75 illus., 2 illus. in color.  |b online resource. 
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490 1 |a SpringerBriefs in Reliability,  |x 2196-1131 
505 0 |a Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. 
520 |a Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. . 
650 0 |a Security systems. 
650 0 |a Electronic circuits. 
650 0 |a Atoms. 
650 0 |a Molecules. 
650 1 4 |a Security Science and Technology. 
650 2 4 |a Electronic Circuits and Systems. 
650 2 4 |a Atomic, Molecular and Chemical Physics. 
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