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Electrical Design of Through Silicon Via

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...

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Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	Lee, Manho (Editor ), Pak, Jun So (Editor ), Kim, Joungho (Editor )
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
Edición:	1st ed. 2014.
Temas:	Electronic circuits. Computers, Special purpose. Electronic Circuits and Systems. Special Purpose and Application-Based Systems.
Acceso en línea:	Texto Completo

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