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Electrical Design of Through Silicon Via
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2014.
|
| Edición: | 1st ed. 2014. |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
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| 001 | 978-94-017-9038-3 | ||
| 003 | DE-He213 | ||
| 005 | 20220117143533.0 | ||
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| 008 | 140511s2014 ne | s |||| 0|eng d | ||
| 020 | |a 9789401790383 |9 978-94-017-9038-3 | ||
| 024 | 7 | |a 10.1007/978-94-017-9038-3 |2 doi | |
| 050 | 4 | |a TK7867-7867.5 | |
| 072 | 7 | |a TJFC |2 bicssc | |
| 072 | 7 | |a TEC008010 |2 bisacsh | |
| 072 | 7 | |a TJFC |2 thema | |
| 082 | 0 | 4 | |a 621.3815 |2 23 |
| 245 | 1 | 0 | |a Electrical Design of Through Silicon Via |h [electronic resource] / |c edited by Manho Lee, Jun So Pak, Joungho Kim. |
| 250 | |a 1st ed. 2014. | ||
| 264 | 1 | |a Dordrecht : |b Springer Netherlands : |b Imprint: Springer, |c 2014. | |
| 300 | |a IX, 280 p. 249 illus. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 505 | 0 | |a Preface -- 1 Introduction -- 2 Electrical Modeling of a Through-Silicon Via (TSV) -- 3 High-speed TSV-based Channel Modeling and Design -- 4 Noise Coupling and Shielding in 3D ICs -- 5 Thermal Effects on TSV Signal Integrity -- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain -- 7 TSV Decoupling Schemes -- Index. | |
| 520 | |a Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. | ||
| 650 | 0 | |a Electronic circuits. | |
| 650 | 0 | |a Computers, Special purpose. | |
| 650 | 1 | 4 | |a Electronic Circuits and Systems. |
| 650 | 2 | 4 | |a Special Purpose and Application-Based Systems. |
| 700 | 1 | |a Lee, Manho. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Pak, Jun So. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Kim, Joungho. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9789401790390 |
| 776 | 0 | 8 | |i Printed edition: |z 9789401790376 |
| 776 | 0 | 8 | |i Printed edition: |z 9789401779494 |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-94-017-9038-3 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
| 912 | |a ZDB-2-SXE | ||
| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||