Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System

This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of re...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Samukawa, Seiji (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Tokyo : Springer Japan : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:SpringerBriefs in Applied Sciences and Technology,
Temas:
Microtechnology.
Microelectromechanical systems.
Nanoscience.
Nanotechnology.
Plasma (Ionized gases).
Semiconductors.
Microsystems and MEMS.
Nanophysics.
Plasma Physics.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction
  • On-wafer UV sensor and prediction of UV irradiation damage
  • Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System
  • Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.

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