Design of Adhesive Joints Under Humid Conditions

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: da Silva, Lucas F. M. (Editor ), Sato, Chiaki (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:Advanced Structured Materials, 25
Temas:
Surfaces (Technology).
Thin films.
Mechanics, Applied.
Solids.
Polymers.
Aerospace engineering.
Astronautics.
Surfaces, Interfaces and Thin Film.
Solid Mechanics.
Aerospace Technology and Astronautics.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Diffusion of moisture in adhesives
  • Diffusion of moisture in interfaces
  • Surface treatments for moisture resistance
  • Influence of moisture on the adhesive properties
  • Influence of water on the interface properties
  • Prediction of joint strength under humid conditions: Continuum mechanics approach
  • Prediction of joint strength under humid conditions: Fracture mechanics approach
  • Prediction of joint strength under humid conditions: Damage mechanics approach.

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