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Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging /

The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requiremen...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Gerlach, Gerald (Editor ), Wolter, Klaus-Jürgen (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2012.
Edición:1st ed. 2012.
Temas:
Acceso en línea:Texto Completo

MARC

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245 1 0 |a Bio and Nano Packaging Techniques for Electron Devices  |h [electronic resource] :  |b Advances in Electronic Device Packaging /  |c edited by Gerald Gerlach, Klaus-Jürgen Wolter. 
250 |a 1st ed. 2012. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2012. 
300 |a XII, 628 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
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338 |a online resource  |b cr  |2 rdacarrier 
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505 0 |a General Aspects -- 3D Modelling and Design for Nems -- Nanoparticles -- Nanopatterning -- Metallization -- Nano- and Bio-Functionalized Surfaces -- Biocompatible Packaging -- Thermal Management -- System-In-Package For Mems and Moems. 
520 |a The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging. 
650 0 |a Nanotechnology. 
650 0 |a Optical materials. 
650 0 |a Materials-Analysis. 
650 1 4 |a Nanotechnology. 
650 2 4 |a Optical Materials. 
650 2 4 |a Characterization and Analytical Technique. 
700 1 |a Gerlach, Gerald.  |e editor.  |4 edt  |4 http://id.loc.gov/vocabulary/relators/edt 
700 1 |a Wolter, Klaus-Jürgen.  |e editor.  |4 edt  |4 http://id.loc.gov/vocabulary/relators/edt 
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