Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules /

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Fischer-Hirchert, Ulrich H. P. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Telecommunication.
Microtechnology.
Microelectromechanical systems.
Electronic circuits.
Microwaves, RF Engineering and Optical Communications.
Microsystems and MEMS.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction into Photonic Packaging
  • Optical waveguides
  • Optical Mode Field Adaptation
  • Fiber-chip-coupling
  • RF Lines
  • Soldering, Adhesive Bonding, Bonding
  • Optical Coneection Technology
  • Active Adjustment Techniques
  • Passive Adjustment Techniques
  • Optical Motherboard
  • Fiber-Optic Modules
  • From Chip Design to the Optimum Package
  • Reliability Tests
  • Abbreviations
  • Index.

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