Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules /

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Fischer-Hirchert, Ulrich H. P. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Telecommunication.
Microtechnology.
Microelectromechanical systems.
Electronic circuits.
Microwaves, RF Engineering and Optical Communications.
Microsystems and MEMS.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo

MARC

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100 1 |a Fischer-Hirchert, Ulrich H. P.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Photonic Packaging Sourcebook  |h [electronic resource] :  |b Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules /  |c by Ulrich H. P. Fischer-Hirchert. 
250 |a 1st ed. 2015. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2015. 
300 |a XIX, 325 p. 287 illus., 16 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index. 
520 |a This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. 
650 0 |a Telecommunication. 
650 0 |a Microtechnology. 
650 0 |a Microelectromechanical systems. 
650 0 |a Electronic circuits. 
650 1 4 |a Microwaves, RF Engineering and Optical Communications. 
650 2 4 |a Microsystems and MEMS. 
650 2 4 |a Electronic Circuits and Systems. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783642253775 
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776 0 8 |i Printed edition:  |z 9783662521359 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-3-642-25376-8  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712) 

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