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3-Dimensional VLSI A 2.5-Dimensional Integration Scheme /
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-mo...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2010.
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| Edición: | 1st ed. 2010. |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
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| 024 | 7 | |a 10.1007/978-3-642-04157-0 |2 doi | |
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| 100 | 1 | |a Deng, Yangdong. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a 3-Dimensional VLSI |h [electronic resource] : |b A 2.5-Dimensional Integration Scheme / |c by Yangdong Deng, Wojciech P. Maly. |
| 250 | |a 1st ed. 2010. | ||
| 264 | 1 | |a Berlin, Heidelberg : |b Springer Berlin Heidelberg : |b Imprint: Springer, |c 2010. | |
| 300 | |a 200 p. 50 illus. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
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| 505 | 0 | |a A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work. | |
| 520 | |a "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. | ||
| 650 | 0 | |a Electronic circuits. | |
| 650 | 1 | 4 | |a Electronic Circuits and Systems. |
| 700 | 1 | |a Maly, Wojciech P. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9783642041785 |
| 776 | 0 | 8 | |i Printed edition: |z 9783642041563 |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-3-642-04157-0 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
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| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||