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100301s2008 gw | s |||| 0|eng d |
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|a 9783540766643
|9 978-3-540-76664-3
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|a 10.1007/978-3-540-76664-3
|2 doi
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|a TA418.7-418.76
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|a TA418.9.T45
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|a TGM
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|a 620.44
|2 23
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|a Reactive Sputter Deposition
|h [electronic resource] /
|c edited by Diederik Depla, Stijn Mahieu.
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|a 1st ed. 2008.
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|a Berlin, Heidelberg :
|b Springer Berlin Heidelberg :
|b Imprint: Springer,
|c 2008.
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|a XVIII, 572 p.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a text file
|b PDF
|2 rda
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|a Springer Series in Materials Science,
|x 2196-2812 ;
|v 109
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|a Simulation of the Sputtering Process -- Electron Emission from Surfaces Induced by Slow Ions and Atoms -- Modeling of the Magnetron Discharge -- Modelling of Reactive Sputtering Processes -- Depositing Aluminium Oxide: A Case Study of Reactive Magnetron Sputtering -- Transport of Sputtered Particles Through the Gas Phase -- Energy Deposition at the Substrate in a Magnetron Sputtering System -- Process Diagnostics -- Optical Plasma Diagnostics During Reactive Magnetron Sputtering -- Reactive Magnetron Sputtering of Indium Tin Oxide Thin Films: The Cross-Corner and Cross-Magnetron Effect -- Reactively Sputter-Deposited Solid Electrolytes and Their Applications -- Reactive SputteredWide-Bandgap p-Type Semiconducting Spinel AB2O4 and Delafossite ABO2 Thin Films for "Transparent Electronics" -- Oxide-Based Electrochromic Materials and Devices Prepared by Magnetron Sputtering -- Atomic Assembly of Magnetoresistive Multilayers.
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|a The use of thin films is continuously expanding. In the family of Physical Vapour Deposition techniques, sputtering is one of the most important over the past 40 years. In this book, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to: - start with reactive magnetron sputtering - understand and investigate the technique - control their sputtering process - tune their existing process, obtaining the desired thin films.
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|a Surfaces (Technology).
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|a Thin films.
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|a Condensed matter.
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|a Physical chemistry.
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|a Chemistry, Technical.
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|a Surfaces, Interfaces and Thin Film.
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|a Condensed Matter Physics.
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|a Physical Chemistry.
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|a Industrial Chemistry.
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|a Depla, Diederik.
|e editor.
|4 edt
|4 http://id.loc.gov/vocabulary/relators/edt
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700 |
1 |
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|a Mahieu, Stijn.
|e editor.
|4 edt
|4 http://id.loc.gov/vocabulary/relators/edt
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710 |
2 |
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|a SpringerLink (Online service)
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|t Springer Nature eBook
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776 |
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|i Printed edition:
|z 9783540869504
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776 |
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|i Printed edition:
|z 9783642095368
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776 |
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|i Printed edition:
|z 9783540766629
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830 |
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|a Springer Series in Materials Science,
|x 2196-2812 ;
|v 109
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856 |
4 |
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|u https://doi.uam.elogim.com/10.1007/978-3-540-76664-3
|z Texto Completo
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|a ZDB-2-CMS
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912 |
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|a ZDB-2-SXC
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|a Chemistry and Materials Science (SpringerNature-11644)
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950 |
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|a Chemistry and Material Science (R0) (SpringerNature-43709)
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