Cargando…

Ion Implantation and Synthesis of Materials

Ion implantation is one of the key processing steps in silicon integrated circuit technology. Some integrated circuits require up to 17 implantation steps and circuits are seldom processed with less than 10 implantation steps. Controlled doping at controlled depths is an essential feature of implant...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Nastasi, Michael (Autor), Mayer, James W. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2006.
Edición:1st ed. 2006.
Temas:
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-3-540-45298-0
003 DE-He213
005 20220118234625.0
007 cr nn 008mamaa
008 100301s2006 gw | s |||| 0|eng d
020 |a 9783540452980  |9 978-3-540-45298-0 
024 7 |a 10.1007/978-3-540-45298-0  |2 doi 
050 4 |a QC787.P3 
072 7 |a PHP  |2 bicssc 
072 7 |a SCI051000  |2 bisacsh 
072 7 |a PHP  |2 thema 
082 0 4 |a 539.73  |2 23 
100 1 |a Nastasi, Michael.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Ion Implantation and Synthesis of Materials  |h [electronic resource] /  |c by Michael Nastasi, James W. Mayer. 
250 |a 1st ed. 2006. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2006. 
300 |a XIV, 263 p. 131 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a General Features and Fundamental Concepts -- Particle Interactions -- Dynamics of Binary Elastic Collisions -- Cross-Section -- Ion Stopping -- Ion Range and Range Distribution -- Displacements and Radiation Damage -- Channeling -- Doping, Diffusion and Defects in Ion-Implanted Si -- Crystallization and Regrowth of Amorphous Si -- Si Slicing and Layer Transfer: Ion-Cut -- Surface Erosion During Implantation: Sputtering -- Ion-Induced Atomic Intermixing at the Interface: Ion Beam Mixing -- Application of Ion Implantation Techniques in CMOS Fabrication -- Ion implantation in CMOS Technology: Machine Challenges. 
520 |a Ion implantation is one of the key processing steps in silicon integrated circuit technology. Some integrated circuits require up to 17 implantation steps and circuits are seldom processed with less than 10 implantation steps. Controlled doping at controlled depths is an essential feature of implantation. Ion beam processing can also be used to improve corrosion resistance, to harden surfaces, to reduce wear and, in general, to improve materials properties. This book presents the physics and materials science of ion implantation and ion beam modification of materials. It covers ion-solid interactions used to predict ion ranges, ion straggling and lattice disorder. Also treated are shallow-junction formation and slicing silicon with hydrogen ion beams. Topics important for materials modification, such as ion-beam mixing, stresses, and sputtering, are also described. 
650 0 |a Particle accelerators. 
650 0 |a Condensed matter. 
650 0 |a Optical materials. 
650 0 |a Materials-Analysis. 
650 0 |a Physical chemistry. 
650 1 4 |a Accelerator Physics. 
650 2 4 |a Condensed Matter Physics. 
650 2 4 |a Optical Materials. 
650 2 4 |a Characterization and Analytical Technique. 
650 2 4 |a Physical Chemistry. 
700 1 |a Mayer, James W.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783642062599 
776 0 8 |i Printed edition:  |z 9783540804826 
776 0 8 |i Printed edition:  |z 9783540236740 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-3-540-45298-0  |z Texto Completo 
912 |a ZDB-2-PHA 
912 |a ZDB-2-SXP 
950 |a Physics and Astronomy (SpringerNature-11651) 
950 |a Physics and Astronomy (R0) (SpringerNature-43715)