Force Sensors for Microelectronic Packaging Applications

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Schwizer, Jürg (Autor), Mayer, Michael (Autor), Brand, Oliver (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2005.
Edición:1st ed. 2005.
Colección:Microtechnology and MEMS,
Temas:
Nanotechnology.
Optical materials.
Engineering.
Security systems.
Electronics.
Optical Materials.
Technology and Engineering.
Security Science and Technology.
Electronics and Microelectronics, Instrumentation.
Acceso en línea:Texto Completo

MARC

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100 1 |a Schwizer, Jürg.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Force Sensors for Microelectronic Packaging Applications  |h [electronic resource] /  |c by Jürg Schwizer, Michael Mayer, Oliver Brand. 
250 |a 1st ed. 2005. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2005. 
300 |a VIII, 178 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
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490 1 |a Microtechnology and MEMS,  |x 2365-0680 
505 0 |a Sensor Design -- Measurement System -- Characterization -- Applications -- Conclusions and Outlook. 
520 |a This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging. 
650 0 |a Nanotechnology. 
650 0 |a Optical materials. 
650 0 |a Engineering. 
650 0 |a Security systems. 
650 0 |a Electronics. 
650 1 4 |a Nanotechnology. 
650 2 4 |a Optical Materials. 
650 2 4 |a Technology and Engineering. 
650 2 4 |a Security Science and Technology. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
700 1 |a Mayer, Michael.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Brand, Oliver.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783642060632 
776 0 8 |i Printed edition:  |z 9783540802150 
776 0 8 |i Printed edition:  |z 9783540221876 
830 0 |a Microtechnology and MEMS,  |x 2365-0680 
856 4 0 |u https://doi.uam.elogim.com/10.1007/b138345  |z Texto Completo 
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950 |a Chemistry and Materials Science (SpringerNature-11644) 
950 |a Chemistry and Material Science (R0) (SpringerNature-43709) 

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