3D Stacked Chips From Emerging Processes to Heterogeneous Systems /

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Elfadel, Ibrahim (Abe) M. (Editor ), Fettweis, Gerhard (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2016.
Edición:1st ed. 2016.
Temas:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction to Electrical 3D Integration
  • Copper-based TSV - Interposer
  • Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization
  • Energy Efficient Electrical Intra-Chip Stack Communication
  • Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks
  • Energy Efficient Communications Employing 1-Bit Quantization at the Receiver
  • 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications
  • Accurate Temperature Measurement for 3D Thermal Management
  • EDA Environments for 3D Chip Stacks
  • Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias
  • Introduction to Optical Inter- and Intraconnects
  • Optical Through-Silicon Vias
  • Integrated Optical Devices for 3D Photonic Transceivers
  • Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators
  • Athermal photonic circuits for optical on-chip interconnects
  • Integrated Circuits for 3D Photonic Transceivers
  • Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.

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