Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kondo, Kazuo (Editor ), Kada, Morihiro (Editor ), Takahashi, Kenji (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Electrochemistry.
Electrical engineering.
Semiconductors.
Mechanical engineering.
Biomedical engineering.
Electrical and Electronic Engineering.
Mechanical Engineering.
Biomedical Engineering and Bioengineering.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Research and Development History of Three Dimensional (3D) Integration Technology
  • Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
  • TSV Processes
  • Wafer and Die Bonding Processes
  • Metrology and Inspection
  • TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
  • Trends in 3D Integrated Circuit (3D-IC) Testing Technology
  • Dream Chip Project at ASET.

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