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Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cham :
Springer International Publishing : Imprint: Springer,
2015.
|
| Edición: | 1st ed. 2015. |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
| LEADER | 00000nam a22000005i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-18675-7 | ||
| 003 | DE-He213 | ||
| 005 | 20220117181950.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 151209s2015 sz | s |||| 0|eng d | ||
| 020 | |a 9783319186757 |9 978-3-319-18675-7 | ||
| 024 | 7 | |a 10.1007/978-3-319-18675-7 |2 doi | |
| 050 | 4 | |a QD551-578 | |
| 072 | 7 | |a PNRH |2 bicssc | |
| 072 | 7 | |a SCI013050 |2 bisacsh | |
| 072 | 7 | |a PNRH |2 thema | |
| 082 | 0 | 4 | |a 541.37 |2 23 |
| 245 | 1 | 0 | |a Three-Dimensional Integration of Semiconductors |h [electronic resource] : |b Processing, Materials, and Applications / |c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. |
| 250 | |a 1st ed. 2015. | ||
| 264 | 1 | |a Cham : |b Springer International Publishing : |b Imprint: Springer, |c 2015. | |
| 300 | |a XIX, 408 p. 460 illus., 269 illus. in color. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 505 | 0 | |a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET. | |
| 520 | |a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. | ||
| 650 | 0 | |a Electrochemistry. | |
| 650 | 0 | |a Electrical engineering. | |
| 650 | 0 | |a Semiconductors. | |
| 650 | 0 | |a Mechanical engineering. | |
| 650 | 0 | |a Biomedical engineering. | |
| 650 | 1 | 4 | |a Electrochemistry. |
| 650 | 2 | 4 | |a Electrical and Electronic Engineering. |
| 650 | 2 | 4 | |a Semiconductors. |
| 650 | 2 | 4 | |a Mechanical Engineering. |
| 650 | 2 | 4 | |a Biomedical Engineering and Bioengineering. |
| 700 | 1 | |a Kondo, Kazuo. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Kada, Morihiro. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Takahashi, Kenji. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9783319186740 |
| 776 | 0 | 8 | |i Printed edition: |z 9783319186764 |
| 776 | 0 | 8 | |i Printed edition: |z 9783319792552 |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-3-319-18675-7 |z Texto Completo |
| 912 | |a ZDB-2-CMS | ||
| 912 | |a ZDB-2-SXC | ||
| 950 | |a Chemistry and Materials Science (SpringerNature-11644) | ||
| 950 | |a Chemistry and Material Science (R0) (SpringerNature-43709) | ||