Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kondo, Kazuo (Editor ), Kada, Morihiro (Editor ), Takahashi, Kenji (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Electrochemistry.
Electrical engineering.
Semiconductors.
Mechanical engineering.
Biomedical engineering.
Electrical and Electronic Engineering.
Mechanical Engineering.
Biomedical Engineering and Bioengineering.
Acceso en línea:Texto Completo
Descripción
Sumario:This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Descripción Física:XIX, 408 p. 460 illus., 269 illus. in color. online resource.
ISBN:9783319186757

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