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Thermal Transport in Oblique Finned Micro/Minichannels
The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical obl...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cham :
Springer International Publishing : Imprint: Springer,
2015.
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| Edición: | 1st ed. 2015. |
| Colección: | SpringerBriefs in Thermal Engineering and Applied Science,
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| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
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| 001 | 978-3-319-09647-6 | ||
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| 008 | 141015s2015 sz | s |||| 0|eng d | ||
| 020 | |a 9783319096476 |9 978-3-319-09647-6 | ||
| 024 | 7 | |a 10.1007/978-3-319-09647-6 |2 doi | |
| 050 | 4 | |a TJ265 | |
| 050 | 4 | |a TP156.M3 | |
| 072 | 7 | |a TGMB |2 bicssc | |
| 072 | 7 | |a SCI065000 |2 bisacsh | |
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| 100 | 1 | |a Fan, Yan. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Thermal Transport in Oblique Finned Micro/Minichannels |h [electronic resource] / |c by Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee. |
| 250 | |a 1st ed. 2015. | ||
| 264 | 1 | |a Cham : |b Springer International Publishing : |b Imprint: Springer, |c 2015. | |
| 300 | |a XIII, 130 p. 95 illus., 80 illus. in color. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 490 | 1 | |a SpringerBriefs in Thermal Engineering and Applied Science, |x 2193-2549 | |
| 505 | 0 | |a Introduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References. | |
| 520 | |a The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels. | ||
| 650 | 0 | |a Thermodynamics. | |
| 650 | 0 | |a Heat engineering. | |
| 650 | 0 | |a Heat transfer. | |
| 650 | 0 | |a Mass transfer. | |
| 650 | 0 | |a Fluid mechanics. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Electric power production. | |
| 650 | 0 | |a Machinery. | |
| 650 | 1 | 4 | |a Engineering Thermodynamics, Heat and Mass Transfer. |
| 650 | 2 | 4 | |a Engineering Fluid Dynamics. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Electrical Power Engineering. |
| 650 | 2 | 4 | |a Mechanical Power Engineering. |
| 650 | 2 | 4 | |a Machinery and Machine Elements. |
| 700 | 1 | |a Lee, Poh Seng. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a Singh, Pawan Kumar. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a Lee, Yong Jiun. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
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| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9783319096483 |
| 776 | 0 | 8 | |i Printed edition: |z 9783319096469 |
| 830 | 0 | |a SpringerBriefs in Thermal Engineering and Applied Science, |x 2193-2549 | |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-3-319-09647-6 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
| 912 | |a ZDB-2-SXE | ||
| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||