Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Salah, Khaled (Autor), Ismail, Yehea (Autor), El-Rouby, Alaa (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Colección:Analog Circuits and Signal Processing,
Temas:
Electronic circuits.
Electronics.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Processor Architectures.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction: Work around Moore's Law
  • 3D/TSV Enabling Technologies
  • TSV Modeling and Analysis
  • TSV Verification
  • TSV Macro-Modeling Framework
  • TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter
  • Imperfection in TSV Modeling
  • New Trends in TSV
  • TSV Fabrication
  • Conclusions.

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