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Arbitrary Modeling of TSVs for 3D Integrated Circuits
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cham :
Springer International Publishing : Imprint: Springer,
2015.
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| Edición: | 1st ed. 2015. |
| Colección: | Analog Circuits and Signal Processing,
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| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
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| 001 | 978-3-319-07611-9 | ||
| 003 | DE-He213 | ||
| 005 | 20220114113638.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 140821s2015 sz | s |||| 0|eng d | ||
| 020 | |a 9783319076119 |9 978-3-319-07611-9 | ||
| 024 | 7 | |a 10.1007/978-3-319-07611-9 |2 doi | |
| 050 | 4 | |a TK7867-7867.5 | |
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| 100 | 1 | |a Salah, Khaled. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Arbitrary Modeling of TSVs for 3D Integrated Circuits |h [electronic resource] / |c by Khaled Salah, Yehea Ismail, Alaa El-Rouby. |
| 250 | |a 1st ed. 2015. | ||
| 264 | 1 | |a Cham : |b Springer International Publishing : |b Imprint: Springer, |c 2015. | |
| 300 | |a IX, 179 p. 159 illus., 99 illus. in color. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 490 | 1 | |a Analog Circuits and Signal Processing, |x 2197-1854 | |
| 505 | 0 | |a Introduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions. | |
| 520 | |a This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor, and inductive-based communication system, and bandpass filtering. ·Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; ·Enables readers to use a model which is technology dependent and can be used for any TSV configuration; ·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; ·Equips readers for fast parasitic extraction of TSVs for 3D IC design. | ||
| 650 | 0 | |a Electronic circuits. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Microprocessors. | |
| 650 | 0 | |a Computer architecture. | |
| 650 | 1 | 4 | |a Electronic Circuits and Systems. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Processor Architectures. |
| 700 | 1 | |a Ismail, Yehea. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a El-Rouby, Alaa. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9783319076102 |
| 776 | 0 | 8 | |i Printed edition: |z 9783319076126 |
| 776 | 0 | 8 | |i Printed edition: |z 9783319374970 |
| 830 | 0 | |a Analog Circuits and Signal Processing, |x 2197-1854 | |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-3-319-07611-9 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
| 912 | |a ZDB-2-SXE | ||
| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||