Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge res...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Noia, Brandon (Autor), Chakrabarty, Krishnendu (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Temas:
Electronic circuits.
Microprocessors.
Computer architecture.
Semiconductors.
Electronic Circuits and Systems.
Processor Architectures.
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-3-319-02378-6
003 DE-He213
005 20220117022401.0
007 cr nn 008mamaa
008 131115s2014 sz | s |||| 0|eng d
020 |a 9783319023786  |9 978-3-319-02378-6 
024 7 |a 10.1007/978-3-319-02378-6  |2 doi 
050 4 |a TK7867-7867.5 
072 7 |a TJFC  |2 bicssc 
072 7 |a TEC008010  |2 bisacsh 
072 7 |a TJFC  |2 thema 
082 0 4 |a 621.3815  |2 23 
100 1 |a Noia, Brandon.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs  |h [electronic resource] /  |c by Brandon Noia, Krishnendu Chakrabarty. 
250 |a 1st ed. 2014. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2014. 
300 |a XVIII, 245 p. 133 illus., 115 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Introduction -- Wafer Stacking and 3D Memory Test -- Built-in Self-Test for TSVs -- Pre-Bond TSV Test Through TSV Probing -- Pre-Bond TSV Test Through TSV Probing -- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths -- Post-Bond Test Wrappers and Emerging Test Standards -- Test-Architecture Optimization and Test Scheduling -- Conclusions. 
520 |a This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.  Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization.  Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.   • Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs; • Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations; • Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.  . 
650 0 |a Electronic circuits. 
650 0 |a Microprocessors. 
650 0 |a Computer architecture. 
650 0 |a Semiconductors. 
650 1 4 |a Electronic Circuits and Systems. 
650 2 4 |a Processor Architectures. 
650 2 4 |a Semiconductors. 
700 1 |a Chakrabarty, Krishnendu.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783319023793 
776 0 8 |i Printed edition:  |z 9783319023779 
776 0 8 |i Printed edition:  |z 9783319345345 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-3-319-02378-6  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712) 

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