Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8 Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /

This critical collection presents early findings and case studies on a wide range of areas, as presented in  the Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics. The collection includes papers in the following general technical research areas: • Advances in Residual S...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Rossi, Marco (Editor ), Sasso, Marco (Editor ), Connesson, Nathanael (Editor ), Singh, Raman (Editor ), DeWald, Adrian (Editor ), Backman, David (Editor ), Gloeckner, Paul (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:Conference Proceedings of the Society for Experimental Mechanics Series,
Temas:
Mechanical engineering.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Mechanics, Applied.
Solids.
Mechanical Engineering.
Engineering Thermodynamics, Heat and Mass Transfer.
Solid Mechanics.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings
  • Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part I: Discretization and Algorithm
  • Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part II: Hardware Design and Demonstration
  • Crack Nucleation Threshold Under Fretting Loading by a Thermal Method
  • Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis
  • Crack Detection in Large Welded Components Under Fatigue Using TSA
  • Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout
  • Quantitative Themographic Characterization of Composites
  • Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit
  • Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.

Ejemplares similares