Silver Metallization Stability and Reliability /

Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Adams, Daniel (Autor), Alford, Terry L. (Autor), Mayer, James W. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : Springer London : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Colección:Engineering Materials and Processes,
Temas:
Surfaces (Physics).
Industrial engineering.
Production engineering.
Metals.
Surfaces (Technology).
Thin films.
Manufactures.
Surface and Interface and Thin Film.
Industrial and Production Engineering.
Metals and Alloys.
Surfaces, Interfaces and Thin Film.
Machines, Tools, Processes.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Silver Thin Film Characterization
  • Diffusion Barriers and Self-encapsulation
  • Thermal Stability
  • Silver Electromigration Resistance
  • Integration Issues
  • Summary.

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